Publications Details
Electron beam joining of structural ceramics
Feasibility of ceramic joining using a high energy (10 MeV) electron beam. The experiments used refractory metals as bonding materials in buried interfaces between Si{sub 3}N{sub 4} pieces. Because the heat capacity of the metal bonding layer is much lower than the ceramic, the metal reaches much higher temperatures than the adjoining ceramic. Using the right combination of beam parameters allows the metal to be melted without causing the adjoining ceramics to melt or decompose. Beam energy deposition and thermal simulations were performed to guide the experiments. Joints were shear tested and interfaces between the metal and the ceramic were examined to identify the bonding mechanism. Specimens joined by electron beams were compared to specimens produced by hot-pressing. Similar reactions occurred using both processes. Reactions between the metal and ceramic produced silicides that bond the metal to the ceramic. The molybdenum silicide reaction products appeared to be more brittle than the platinum silicides. Si{sub 3}N{sub 4} was also joined to Si{sub 3} N{sub 4} directly. The bonding appears to have been produced by the flow of intergranular glass into the interface. Shear strength was similar to the metal bonded specimens. Bend specimens Of Si{sub 3}N{sub 4} were exposed to electron beams with similar parameters to those used in joining experiments to determine how beam exposure degrades the strength. Damage was macroscopic in nature with craters being tonned by material ablation, and cracking occurring due to excessive thermal stresses. Si was also observed on the surface indicating the Si{sub 3}N{sub 4} was decomposing. Bend strength after exposure was 62% of the asreceived strength. No obvious microstructural differences were observed in the material close to the damaged region compared to material in regions far away from the damage.