Publications Details

Capillary flow solderability test for printed wiring boards

Hosking, F.M.; Yost, F.G.; Hernandez, C.L.; Sackinger, S.J.

This report describes a new technique for evaluating capillary flow solderability on printed circuit boards. The test involves the flow of molten solder from a pad onto different-sized conductor lines. It simulates the spreading dynamics of either plated-through-hole (PTH) or surface mount technology (SMT) soldering. A standard procedure has been developed for the test. Preliminary experiments were conducted and the results demonstrate test feasibility. Test procedures and results are presented in this report.