Publications Details
A novel lead-free solder replacement
Environmental and toxicity concerns related to the use of lead have initiated the search for acceptable, alternate joining materials for electronics assembly. This paper describes a novel lead-free solder designed as a ``drop in`` replacement for common tin/lead eutectic solder. The physical and mechanical properties of this solder are discussed in comparison to tin/lead eutectic solder. The performance of this solder when used for electronics assembly is discussed and compared to other common solders. Fatigue testing results are reported for thermal cycling electronics assemblies soldered with this lead-free composition. The paper concludes with a discussion on indium metal availability, supply and price.