Understanding the Run-out Behavior of a Ag-Cu-Zr Braze Alloy When Used to Join Alumina to an Fe-Ni-Co Alloy
Abstract not provided.
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Jump to search filtersINSPECTION DICONTINUITIES AND DEFECTS
Abstract not provided.
Understanding the Run-out Behavior of a Ag-Cu-Zr Braze Alloy When Used to Join Alumina to an Fe-Ni-Co Alloy
Abstract not provided.
Reliability Analysis of Pin-in-Hole Solder Joints by Computational Modeling
Abstract not provided.
UCPD model for Pb-free solder
Journal of Electronic Packaging, Transactions of the ASME
A unified creep plasticity damage (UCPD) model for eutectic Sn-Pb and Pb-free solders was developed and implemented into finite element analysis codes. The new model will be described along with the relationship between the model's damage evolution equation and an empirical Coffin-Manson relationship for solder fatigue. Next, developments needed to model crack initiation and growth in solder joints will be described. Finally, experimentally observed cracks in typical solder joints subjected to thermal mechanical fatigue are compared with model predictions. Finite element based modeling is particularly suited for predicting solder joint fatigue of advanced electronics packaging, e.g. package-on-package (PoP), because it allows for evaluation of a variety of package materials and geometries.
Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth in Thin Films
Abstract not provided.
Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth in Thin Films
Abstract not provided.
Laser Ablation of Thin Films on LTCC
Abstract not provided.
Accelerated aging and testing of thin films on LTCC test vehicles
Abstract not provided.
Accelerated aging and testing of thin films on LTCC test vehicles
Abstract not provided.
High-reliability electronics rely upon connectors
Abstract not provided.
Pb-Free Solder Technology in Aerospace and Defense: Surface Finishes ? Somewhere Over the Rainbow ?
Abstract not provided.
Sensitivity of Copper Dissolution to the Flow Behavior of Molten Sn-Pb Solder
Abstract not provided.
Employing Micro-XRF for detection of trace phases
Abstract not provided.
Pb-Free Solder Technology in Aerospace and Defense: Small Satellite Technology and the Art of Miniaturization
Abstract not provided.
ACCELERATED AGING AND TESTING OF THIN FILM TEST VEHICLES WITH Ag AND Au TKN PASTE
Abstract not provided.
SENSITIVITY OF COPPER DISSOLUTION TO THE FLOW BEHAVIOR OF MOLTEN SN-PB SOLDER
Abstract not provided.
Challenges Facing the High Temperature Electronics Industry in the Event of Restrictions on High-Pb Solders
Abstract not provided.
Laser ablation of thin films on LTCC
Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014
Direct Digital Manufacturing techniques such as laser ablation are proposed for the fabrication of lower cost, miniaturized, and lightweight integrated assemblies with high performance requirements. This paper investigates the laser ablation of a Ti/Cu/Pt/Au thin film metal stack on fired low temperature cofired ceramic (LTCC) surfaces using a 355 nm Nd.YAG diode pumped laser ablation system. It further investigates laser ablation applications using unfil ed, or 'green', LTCC materials: (1) through one layer of a laminated stack of unfiled LTCC tape to a buried thick film conductor ground plane, and (2) in unfiled Au thick films. The UV laser power profile and part fixturing were optimized to address defects such as LTCC microcracking, thin film adhesion failures, and redeposition of Cu and Pt. An alternate design approach to minimize ablation time was tested for efficiency in manufacture. Multichip Modules (MCM) were tested for solder ability', solder leach resistance, and wire bondabilify. Scanning election microscopy (SEM) as well as cross sections and microanalytical techniques were used in this study.
Unified creep plasticity damage (UCPD) model for SAC396 solder
ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
A unified creep plasticity damage (UCPD) model for Sn-Pb and Pb-free solders was developed and implemented into finite element analysis codes. The new model will be described along with the relationship between the model's damage evolution equation and an empirical Coffin-Manson relationship for solder fatigue. Next, developments needed to model crack initiation and growth in solder joints will be described. Finally, experimentally observed cracks in typical solder joints subjected to thermal mechanical fatigue are compared with model predictions. Finite element based modeling is particularly suited for predicting solder joint fatigue of advanced electronics packaging, e.g. package-on-package (PoP), because it allows for evaluation of a variety of package materials and geometries. Copyright © 2013 by ASME.
Controlling braze joint gap uniformity for exceptional tensile strengths
Abstract not provided.
Simulating Solder Fatigue Crack Initiation and Growth in a Surface Mount Package
Abstract not provided.
Two-Sensor System for Absolute Age and Temperature History
Abstract not provided.
PREDICTING THE RELIABILITY OF PACKAGE-ON-PACKAGE INTERCONNECTIONS USING COMPUTATIONAL MODELING SOFTWARE
Abstract not provided.
Forming 3-Dimensional epitaxial Cu/Ag core-shell nanoparticles by thermally reacting Cu and Ag nanoparticles at elevated temperatures
Nano Letter
Abstract not provided.
Results 51–75 of 211