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Fault localization and failure modes in microsystems-enabled photovoltaic devices

IEEE International Reliability Physics Symposium Proceedings

Yang, Benjamin B.; Cruz-Campa, Jose L.; Haase, Gaddi S.; Tangyunyong, Paiboon; Colr, Edward I.; Pimentel, Alejandro A.; Resnick, Paul; Okandan, Murat; Nielson, Gregory N.

Microsystems-enabled photovoltaic (MEPV) technology is a promising approach to lower the cost of solar energy to competitive levels. This paper describes current development efforts to leverage existing silicon integrated circuit (IC) failure analysis (FA) techniques to study MEPV devices. Various FA techniques such as light emission microscopy and laser-based fault localization were used to identify and characterize primary failure modes after fabrication and packaging. The FA results provide crucial information used in provide corrective actions and improve existing MEPV fabrication techniques. © 2013 IEEE.

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Comparison of beam-based failure analysis techniques for microsystems-enabled photovoltaics

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Yang, Benjamin B.; Cruz-Campa, Jose L.; Haase, Gaddi S.; Colr, Edward I.; Tangyunyong, Paiboon; Okandan, Murat; Nielson, Gregory N.

Microsystems-enabled photovoltaics (MEPVs) are microfabricated arrays of thin and efficient solar cells. The scaling effects enabled by this technique results in great potential to meet increasing demands for light-weight photovoltaic solutions with high power density. This paper covers failure analysis techniques used to support the development of MEPVs with a focus on the laser beam-based methods of LIVA, TIVA, OBIC, and SEI. Each FA technique is useful in different situations, and the examples in this paper show the relative advantages of each method for the failure analysis of MEPVs. Copyright © 2013 ASM International® All rights reserved.

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Results 26–34 of 34
Results 26–34 of 34