Frequency Domain Thermoreflectance for Bond Evaluation in Heterogeneously Integrated Microelectronics Hodges, Wyatt L.; Jarzembski, Amun; Mcdonald, Anthony; Treweek, Benjamin; Jordan, Matthew B.; Bahr, Matthew; Walsh, Timothy; Yates, Luke; Pickrell, Gregory W. Abstract not provided. More Details TYPE Conference Paper YEAR 2024 OSTI
Resolution Limits of Frequency Domain Thermoreflectance for Interconnect Damage in Heterogeneously Integrated Microsystems Hodges, Wyatt L.; Jarzembski, Amun; Herkenhoff, Brenden K.; Treweek, Benjamin; Mcdonald, Anthony; Jordan, Matthew B.; Walsh, Timothy; Pickrell, Gregory W. Abstract not provided. More Details TYPE Conference Presentation YEAR 2023 DOIOSTI
Pushing the Spatial and Temporal Limits of Thermoreflectance Measurements Hodges, Wyatt L.; Jarzembski, Amun; Herkenhoff, Brenden K.; Treweek, Benjamin; Mcdonald, Anthony; Jordan, Matthew B.; Wilke, Rudeger H.T.; Walsh, Timothy; Clem, Paul; Pickrell, Gregory W. Abstract not provided. More Details TYPE Conference Presentation YEAR 2022 DOIOSTI