Publications

Martinez, W.M., Anderson, E.M., Wood, M.G., Friedmann, T.A., Arterburn, S.C., Reyna, R., Gutierrez, J.E., Harris, C.A., Kotula, P.G., Cummings, D.P., Bahr, M.N., Patel, V.J., Muhowski, A., Hawkins, S.D., Long, C., Klem, J.F., Shank, J., Wygant, M.L., & Wygant, M.L. (2024). Gasb-to-Si Direct Wafer Bonding and Thermal Budget Considerations for Photonic Applications [Conference Presentation]. 10.2172/2585137

Madaras, S.E., Gehl, M., Starbuck, A.L., Trotter, D., Pomerene, A., Friedmann, T.A., Boady, M.S., Martinez, W.M., Otterstrom, N.T., Chow, W.W., Skogen, E.J., & Skogen, E.J. (2024). 104Hz Linewidth, Self-injection Locked, Chip Scale NIR Laser [Conference Presentation]. 10.2172/2565143

Hackett, L.A.P., Addamane, S.J., Chatterjee, E., Arterburn, S.C., Friedmann, T.A., Soh, D., Lilly, M., Eichenfield, M., Smith, B.P., & Smith, B.P. (2024). Experimental Device for Probing Quantum Acoustoelectric Interaction [Conference Poster]. 10.2172/2540351

Henry, N.C., Martinez, W.M., Sovinec, C.L.H., Friedmann, T.A., Arterburn, S.C., Starbuck, A.L., Dallo, C.M., Pomerene, A., Kodigala, A., & Kodigala, A. (2024). Wide bandwidth TM tunable vernier rings for heterogeneously integrated lasers [Conference Poster]. 2024 Conference on Lasers and Electro-Optics, CLEO 2024. 10.2172/2563828

Kodigala, A., Valdez, F., Mere, V., Mookherjea, S., Boynton, N., Friedmann, T.A., Arterburn, S.C., Dallo, C.M., Pomerene, A., Starbuck, A.L., Lentine, A.L., Trotter, D.C., & Trotter, D.C. (2023). Buried-Electrode Hybrid Bonded Thin-Film Lithium Niobate Electro-Optic Mach-Zehnder Modulators. IEEE Photonics Technology Letters, 35(11), pp. 633-636. 10.1109/lpt.2023.3268605

Wood, M.G., Bahr, M.N., Serkland, D.K., Gutierrez, J.E., Anderson, E.M., Finnegan, P.S., Weatherred, S.E., Martinez, W.M., Foulk, J.W., Reyna, R., Arterburn, S.C., Friedmann, T.A., Hawkins, S.D., Patel, V.J., Hendrickson, A.T., Klem, J.F., Long, C., Olesberg, J.T., Shank, J., … Looker, Q.M. (2023). Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers [Conference Presentation]. CLEO: Science and Innovations, CLEO:S and I 2023. 10.2172/2431289

Boynton, N., Friedmann, T.A., Arterburn, S.C., Musick, K.M., Boady, M.S., Starbuck, A.L., Trotter, D.C., Pomerene, A., Kodigala, A., Lentine, A.L., Morton, P.A., Gehl, M., & Gehl, M. (2023). Thin-Film Lithium Niobate Electro-Optic Modulators with Integrated Silicon Photonic Thermo-Optic Phase Shifters [Conference Presentation]. CLEO: Science and Innovations, CLEO:S and I 2023. 10.2172/2431259

Wood, M.G., Bahr, M.N., Gutierrez, J.E., Anderson, E.M., Finnegan, P.S., Weatherred, S.E., Martinez, W.M., Foulk, J.W., Reyna, R., Arterburn, S.C., Friedmann, T.A., Hawkins, S.D., Patel, V.J., Hendrickson, A.T., Klem, J.F., Long, C., Olesberg, J.T., Shank, J., Chumney, D.R., Looker, Q.M., & Looker, Q.M. (2023). Substrate-Independent Technique of III-V Heterogeneous Integration of Focal Plane Arrays and Lasers [Conference Proceeding]. 2023 Conference on Lasers and Electro Optics CLEO 2023. 10.1364/CLEO_SI.2023.STh3H.5

Hackett, L.A.P., Miller, M., Weatherred, S.E., Arterburn, S.C., Storey, M.J., Peake, G., Dominguez, D., Finnegan, P.S., Friedmann, T.A., Eichenfield, M., & Eichenfield, M. (2023). Non-reciprocal acoustoelectric microwave amplifiers with net gain and low noise in continuous operation. Nature Electronics, 6(1), pp. 76-85. https://doi.org/10.1038/s41928-022-00908-6

Grine, A.J., Siddiqui, A., Keeler, G.A., Shaw, M.J., Eichenfield, M., Friedmann, T.A., Douglas, E.A., Wood, M.G., Dagel, D., Hains, C., Koch, L., Nordquist, C.D., Soudachanh, A.L., Matins, B., Serkland, D.K., & Serkland, D.K. (2022). Optomechanical Spring Effect Readout in Resonant Micro-Optical Sagnac Gyroscopes: Design and Scaling Analysis [Conference Poster]. 10.1109/OMN.2017.8051509

Sierra Suarez, J., Mudrick, J.P., Sennett, C., Friedmann, T.A., Arterburn, S.C., Jordan, M., Caravello, L.A., Gutierrez, J.E., Henry, M.D., & Henry, M.D. (2022). Strategies relating to CMP for die to wafer interconnects utilizing hybrid direct bonding [Conference Poster]. 10.1109/ECTC32862.2020.00304

Hackett, L.A.P., Miller, M., Brimigion, F.M., Dominguez, D., Peake, G., Tauke-Pedretti, A., Arterburn, S.C., Friedmann, T.A., Eichenfield, M., & Eichenfield, M. (2021). Towards single-chip radiofrequency signal processing via acoustoelectric electron–phonon interactions. Nature Communications, 12(1). https://doi.org/10.1038/s41467-021-22935-1

Hackett, L.A.P., Miller, M., Storey, M.J., Dominguez, D., Brimigion, F.M., Digregorio, S., Peake, G., Tauke-Pedretti, A., Arterburn, S.C., Friedmann, T.A., Weinstein, D., Eichenfield, M., & Eichenfield, M. (2021). Active Nonreciprocal and Nonlinear Surface Acoustic Wave Devices in a Heterogeneously Integrated InGaAs on Lithium Niobate Material Platform [Conference Presentation]. 10.2172/1872181

Jordan, M., Rohwer, L.E.S., Mudrick, J.P., Friedmann, T.A., Henry, M.D., & Henry, M.D. (2021). Large Format CMOS Imager Integration Utilizing an Indium Bonding Process and Buried ARC Reveal [Conference Paper]. https://www.osti.gov/biblio/1847471

Douglas, E.A., Hollowell, A.E., Jordan, M., Friedmann, T.A., Wood, M.G., Arrington, C.L., Musick, K.M., McClain, J., & McClain, J. (2020). Advancing Compound Semiconductors Through Heterogeneous Integration [Conference Poster]. https://www.osti.gov/biblio/1821083

Sierra Suarez, J., Mudrick, J.P., Sennett, C., Friedmann, T.A., Arterburn, S.C., Jordan, M., Caravello, L.A., Gutierrez, J.E., Henry, M.D., & Henry, M.D. (2020). Strategies relating to CMP for die to wafer interconnects utilizing hybrid direct bonding [Conference Poster]. Proceedings - Electronic Components and Technology Conference. https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85090290932&origin=inward

Hackett, L.A.P., Miller, M., Brimigion, F.M., Dominguez, D., Peake, G., Tauke-Pedretti, A., Arterburn, S.C., Friedmann, T.A., Eichenfield, M., & Eichenfield, M. (2020). Demonstration of an Acoustoelectric Surface Acoustic Wave Circulator [Conference Poster]. https://www.osti.gov/biblio/1798561

Mudrick, J.P., Sennett, C., Friedmann, T.A., Arterburn, S.C., Jordan, M., Caravello, L.A., Gutierrez, J.E., Henry, M.D., & Henry, M.D. (2020). Strategies relating to CMP for die to wafer interconnects utilizing hybrid direct bonding [Conference Poster]. https://www.osti.gov/biblio/1783674

Boynton, N., Cai, H., Gehl, M., Arterburn, S.C., Dallo, C.M., Pomerene, A., Starbuck, A.L., Hood, D., Trotter, D.C., Friedmann, T.A., Derose, C.T., Lentine, A.L., & Lentine, A.L. (2020). A heterogeneously integrated silicon photonic/lithium niobate travelling wave electro-optic modulator. Optics Express, 28(2), pp. 1868-1884. https://doi.org/10.1364/OE.28.001868

Hackett, L.A.P., Siddiqui, A., Dominguez, D., Douglas, J.K., Tauke-Pedretti, A., Friedmann, T.A., Peake, G., Arterburn, S.C., Miller, M., Eichenfield, M., & Eichenfield, M. (2019). Active and Nonreciprocal Radio-Frequency Acoustic Microsystems. 10.2172/1573926

Boynton, N., Cai, H., Gehl, M., Arterburn, S.C., Dallo, C.M., Pomerene, A., Starbuck, A.L., Hood, D., Trotter, D.C., Friedmann, T.A., Derose, C.T., Lentine, A.L., & Lentine, A.L. (2019). A heterogeneously integrated silicon photonic/lithium niobate platform for RF photonics [Conference Poster]. AVFOP 2019 - Avionics and Vehicle Fiber-Optics and Photonics Conference. 10.1109/AVFOP.2019.8908194

Henry, M.D., Levy, J.E., Bartz, J.A., Mudrick, J.P., Friedmann, T.A., Jordan, M., Rohwer, L.E.S., Trotter, D.C., & Trotter, D.C. (2019). Fabrication techniques for heterogenous integration of 2.5-D Systems [Conference Poster]. https://www.osti.gov/biblio/1642609

Hackett, L.A.P., Siddiqui, A., Dominguez, D., Douglas, J.K., Tauke-Pedretti, A., Friedmann, T.A., Peake, G., Arterburn, S.C., Eichenfield, M., & Eichenfield, M. (2019). High-gain leaky surface acoustic wave amplifier in epitaxial InGaAs on lithium niobate heterostructure. Applied Physics Letters, 114(25). 10.1063/1.5108724

Siddiqui, A., Hackett, L.A.P., Dominguez, D., Tauke-Pedretti, A., Friedmann, T.A., Peake, G., Miller, M., Douglas, J.K., Eichenfield, M., & Eichenfield, M. (2019). Large Acoustoelectric Effect in Wafer Bonded Indium Gallium Arsenide / Lithium Niobate Heterostructure Augmented by Novel Gate Control [Conference Poster]. 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. 10.1109/TRANSDUCERS.2019.8808281

Boynton, N., Cai, H., Gehl, M., Arterburn, S.C., Dallo, C.M., Pomerene, A., Starbuck, A.L., Hood, D., Trotter, D.C., Friedmann, T.A., Lentine, A.L., Derose, C., & Derose, C. (2019). A Heterogeneously Integrated Silicon Photonic/Lithium Niobate Platform for RF Photonics [Conference Poster]. 10.1109/AVFOP.2019.8908194