Publications

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A unified creep plasticity damage (UCPD) model for Sn-Pb solder is developed in this paper. Stephens and Frear (1999) studied the creep behavior of near-eutectic 60Sn-40Pb solder subjected to low strain rates and found that the inelastic (creep and plastic) strain rate could be accurately described using a hyperbolic Sine function of the applied effective stress. A recently developed high-rate servo-hydraulic method was employed to characterize the temperature and strain-rate dependent stress-strain behavior of eutectic Sn-Pb solder over a wide range of strain rates (10{sup -4} to 10{sup 2} per second). The steady state inelastic strain rate data from these latest experiments were also accurately captured by the hyperbolic Sine equation developed by Stephens and Frear. Thus, this equation was used as the basis for the UCPD model for Sn-Pb solder developed in this paper. Stephens, J.J., and Frear, D.R., Metallurgical and Materials Transactions A, Volume 30A, pp. 1301-1313, May 1999.

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Legislated requirements and industry standards are replacing eutectic lead-tin (Pb-Sn) solders with lead-free (Pb-free) solders in future component designs and in replacements and retrofits. Since Pb-free solders have not yet seen service for long periods, their long-term behavior is poorly characterized. Because understanding the reliability of Pb-free solders is critical to supporting the next generation of circuit board designs, it is imperative that we develop, validate and exercise a solder lifetime model that can capture the thermomechanical response of Pb-free solder joints in stockpile components. To this end, an ASC Level 2 milestone was identified for fiscal year 2010: Milestone 3605: Utilize experimentally validated constitutive model for lead-free solder to simulate aging and reliability of solder joints in stockpile components. This report documents the completion of this milestone, including evidence that the milestone completion criteria were met and a summary of the milestone Program Review.

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Glass-to-metal (GTM) seals maintain hermeticity while allowing the passage of electrical signals. Typically, these seals are comprised of one or more metal pins encapsulated in a glass which is contained in a metal shell. In compression seals, the coefficient of thermal expansion of the metal shell is greater than the glass, and the glass is expected to be in compression. Recent development builds of a multi-pin GTM seal revealed severe cracking of the glass, with cracks originating at or near the pin-glass interface, and propagating circumferentially. A series of finite element analyses (FEA) was performed for this seal with the material set: 304 stainless steel (SS304) shell, Schott S-8061 (or equivalent) glass, and Alloy 52 pins. Stress-strain data for both metals was fit by linear-hardening and power-law hardening plasticity models. The glass layer thickness and its location with respect to geometrical features in the shell were varied. Several additional design changes in the shell were explored. Results reveal that: (1) plastic deformation in the small-strain regime in the metals lead to radial tensile stresses in glass, (2) small changes in the mechanical behavior of the metals dramatically change the calculated stresses in the glass, and (3) seemingly minor design changes in the shell geometry influence the stresses in the glass significantly. Based on these results, guidelines for materials selection and design of seals are provided.

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The foam material of interest in this investigation is a rigid closed-cell polyurethane foam PMDI with a nominal density of 20 pcf (320 kg/m3). Three separate types of compression experiments were conducted on foam specimens. The heterogeneous deformation of foam specimens and strain concentration at the foam-steel interface were obtained using the 3-dimensional digital image correlation (3D-DIC) technique. These experiments demonstrated that the 3D-DIC technique is able to obtain accurate and full-field large deformation of foam specimens, including strain concentrations. The experiments also showed the effects of loading configurations on deformation and strain concentration in foam specimens. These DIC results provided experimental data to validate the previously developed viscoplastic foam model (VFM). In the first experiment, cubic foam specimens were compressed uniaxially up to 60%. The full-field surface displacement and strain distributions obtained using the 3D-DIC technique provided detailed information about the inhomogeneous deformation over the area of interest during compression. In the second experiment, compression tests were conducted for cubic foam specimens with a steel cylinder inclusion, which imitate the deformation of foam components in a package under crush conditions. The strain concentration at the interface between the steel cylinder and the foam specimen was studied in detail. In the third experiment, the foam specimens were loaded by a steel cylinder passing through the center of the specimens rather than from its end surface, which created a loading condition of the foam components similar to a package that has been dropped. To study the effects of confinement, the strain concentration and displacement distribution over the defined sections were compared for cases with and without a confinement fixture.

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An interdisciplinary team of scientists and engineers having broad expertise in materials processing and properties, materials characterization, and computational mechanics was assembled to develop science-based modeling/simulation technology to design and reproducibly manufacture high performance and reliable, complex microelectronics and microsystems. The team's efforts focused on defining and developing a science-based infrastructure to enable predictive compaction, sintering, stress, and thermomechanical modeling in ''real systems'', including: (1) developing techniques to and determining materials properties and constitutive behavior required for modeling; (2) developing new, improved/updated models and modeling capabilities, (3) ensuring that models are representative of the physical phenomena being simulated; and (4) assessing existing modeling capabilities to identify advances necessary to facilitate the practical application of Sandia's predictive modeling technology.

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