Publications

Abstract not provided.

Abstract not provided.

Abstract not provided.

The main objective of this project was to develop reliable, low-cost techniques for joining silicon nitride (Si{sub 3}N{sub 4}) to itself and to metals. For Si{sub 3}N{sub 4} to be widely used in advanced turbomachinery applications, joining techniques must be developed that are reliable, cost-effective, and manufacturable. This project addressed those needs by developing and testing two Si{sub 3}N{sub 4} joining systems; oxynitride glass joining materials and high temperature braze alloys. Extensive measurements were also made of the mechanical properties and oxidation resistance of the braze materials. Finite element models were used to predict the magnitudes and positions of the stresses in the ceramic regions of ceramic-to-metal joints sleeve and butt joints, similar to the geometries used for stator assemblies.

Computational materials simulations have traditionally focused on individual phenomena: grain growth, crack propagation, plastic flow, etc. However, real materials behavior results from a complex interplay between phenomena. In this project, the authors explored methods for coupling mesoscale simulations of microstructural evolution and micromechanical response. In one case, massively parallel (MP) simulations for grain evolution and microcracking in alumina stronglink materials were dynamically coupled. In the other, codes for domain coarsening and plastic deformation in CuSi braze alloys were iteratively linked. this program provided the first comparison of two promising ways to integrate mesoscale computer codes. Coupled microstructural/micromechanical codes were applied to experimentally observed microstructures for the first time. In addition to the coupled codes, this project developed a suite of new computational capabilities (PARGRAIN, GLAD, OOF, MPM, polycrystal plasticity, front tracking). The problem of plasticity length scale in continuum calculations was recognized and a solution strategy was developed. The simulations were experimentally validated on stockpile materials.

The near eutectic 60Sn-40Pb alloy is the most commonly used solder for electrical interconnections in electronic packages. This alloy has a number of processing advantages (suitable melting point of 183 C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue), the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes the prediction of solder joint lifetime complex. A viscoplastic constitutive model for solder with an internal state variable that tracks microstructural evolution is currently under development. This constitutive model was implemented in to several finite element codes. With this computational capability, the thermomechanical response of solder interconnects, including microstructural evolution, can be predicted. This capability was applied to predict the thermomechanical response of a ball grid array (BGA) solder interconnect. BGAs with both homogeneous and heterogeneous initial microstructures were evaluated. In this paper, the constitutive model used to describe the solder will first be briefly discussed. The results of computational studies to determine the thermomechanical response of BGA solder interconnects will then be presented.

A new viscoplastic theory for CusilABA and other braze alloys has been developed. Like previous viscoplastic theories,this new theory uses a hyperbolic sine function of effective stress in its kinetic equation for the inelastic strain rate. This new theory has an internal state variable which accounts for isotropic hardening and recovery and a second-order, internal state tensor which accounts for kinematic hardening and recovery. Unlike previous theories, the new theory uses evolution equations for the state variables which describe competing mechanisms of power law hardening and static recovery. The evolution equations used in previous theories describe competing mechanisms of linear hardening, dynamic and static recovery. The new viscoplastic theory was implemented in several finite element codes and used in several metal-to-ceramic brazing simulations. Two approaches for obtaining material parameters for the new viscoplastic theory were developed.

Cellular materials consist of interconnected struts or plates which form cells. The struts or plates are constructed from a variety of metals, polymers, ceramics and wood products. Cellular materials are often used in impact limiters for shipping containers to protect the contents from accidental impact events. These materials exhibit a variety of complex behavior when subjected to crushing loads. This research focuses on the development of continuum representations of cellular solids that can be used in the finite element analysis of shipping container accidents. A significant portion of this work is the development of a new methodology to relate localized deformations to appropriate constitutive descriptions. This methodology provides the insight needed to select constitutive descriptions for cellular solids that capture the localized deformations that are observed experimentally. Constitutive relations are developed for two different cellular materials, aluminum honeycomb and polyurethane foam. These constitutive relations are based on plasticity and continuum damage theories. Plasticity is used to describe the permanent deformation exhibited by both aluminum honeycomb and polyurethane foam. Continuum damage is needed to capture the change in elastic parameters due to cracking of the polyurethane cell wall materials. The new constitutive description of polyurethane foam is implemented in both static and dynamic finite element codes, and analytical and numerical predictions are compared with available experimental data.

A new package for the air transport of hazardous materials is currently being developed in the Transportation Systems Department at Sandia National Laboratories. The baseline design has a unique impact limiter which uses layers of aluminum screen wire and aramid cloth fabric. A primary motivation for selecting this unusual combination of materials is the need for the impact limiter to not only limit the amount of load transmitted to the primary container but also remain in place during impact events so that it provides a thermal barrier during a subsequent fire. A series of uniaxial and confined compression tests indicated that the layered material does not behave like other well characterized materials. No existing constitutive models were able to satisfactorily capture the behavior of the layered material; thus, a new plasticity model was developed. The new material model was then used to characterize the response of air transport packages with layered impact limiters to hypothetical accidental impact events. Responses predicted by these analyses compared favorably with experiments at Sandia`s rocket sled test facility in which a one-fourth scale package was subjected to side and end impacts at velocities of 428 and 650 fps, respectively.

Continuum damage theories describe the progressive reduction in stiffness and strength of brittle materials resulting from the initiation and growth of microcracks and microvoids. When brittle materials are loaded into the nonlinear regime, they often exhibit localized zones of intense deformation and the eventual formation of macrocracks. Criteria for diffuse and discontinuous bifurcations have previously been developed and used to study the initiation of necking and localization in elastic-plastic materials. In this investigation, the same bifurcation criteria are applied to continuum damage theories. Since the bifurcation criteria depend on the fourth-order tangent modulus tensor, the first step in this investigation is the derivation of the tangent modulus tensor for a general continuum damage theory. An eigenanalysis of the symmetric part of the tangent modulus tensor is then shown to fully characterize the potential diffuse and discontinuous bifurcations associated with a given continuum damage theory.