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Six Degrees of Freedom (6DOF) Simulations of Supersonic Fragment Trajectories

Yeh, Peter D.

In this report a process using existing technologies at Sandia National Laboratories (SNL) to simulate the six degrees-of-freedom (6DOF) trajectories of explosive fragments is described and tested. First, aerodynamic forces and moments as functions of orientation are computed using the SIERRA/Aero supersonic flow solver. The forces and moments are normalized and tabulated in a database. Second, this the aerodynamic coefficient database is imported into a 6DOF rigid body dynamics solver in order to compute the resulting trajectories. The supersonic flow simulations are tested for simple geometries and show good agreement with literature values. The simulation procedure is then demonstrated for an example fragment. The results of the example fragment indicate that the distance traveled in the early ight (from 2.5 km/s until decreasing down to 1 km/s) varies widely depending on the initial orientations. The fragment trajectory distribution and steady tumbling rate is explored. The study indicates that a 6DOF analysis will yield information about a spread of possible trajectories, while using an average drag coefficient can only represent the most likely trajectory.

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TYPE SAND Report YEAR 2020
DOIOSTI

Plate Impact and Penetration at the Ballistic Launch Tube: Experiments

Yeh, Peter D.; Donahue, Emily D.; Miller, Timothy J.; Payne, Lloyd R.; Korbin, John P.; Teeter, Russell D.

This report details the data collected from plate impact experiments performed at the Ballistics Launch Tube (BLT) in May 2019. The experiments consisted of 62 shots of copper projectiles (cylindrical and ogive) impacting 1/4", 1/2", and 3/4" aluminum plates at varying velocities. An additional 14 shots of copper cylinders on a 1" steel plate were fired at varying velocities as a Taylor anvil test. We recorded videos of the impact events and resulting fragmentation using a multi-view system of three high speed cameras. The purpose of these tests was to collect high quality data from the multi-view camera system and create digital representations of the deformed target, projectile and fragments. This data is intended to be used as validation data set for high fidelity simulation codes. This report covers the experimental setup, diagnostics, and collected data. Data processing and analysis are underway and will be discussed in a separate report.

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TYPE SAND Report YEAR 2019
DOIOSTI

Bottom-up copper filling of large scale through silicon vias for MEMS technology

Journal of the Electrochemical Society

Menk, Lyle A.; Baca, Ehren B.; Blain, Matthew G.; Smith, A.; Dominguez, Jason J.; McClain, Jaime L.; Yeh, Peter D.; Hollowell, Andrew E.

An electrodeposition process for void-free bottom-up filling of sub-millimeter scale through silicon vias (TSVs) with Cu is detailed. The 600 μm deep and nominally 125 μm diameter metallized vias were filled with Cu in less than 7 hours under potentiostatic control. The electrolyte is comprised of 1.25 mol/L CuSO4 - 0.25 mol/L CH3SO3H with polyether and halide additions that selectively suppress metal deposition on the free surface and side walls. A brief qualitative discussion of the procedures used to identify and optimize the bottom-up void-free feature filling is presented.

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TYPE Journal Article YEAR 2019
DOIOSTIScopus
19 Results
19 Results