Publications

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Novel multilayered FeSiCrB-Fe x N (x = 2-4) metallic glass composites were fabricated using spark plasma sintering of FeSiCrB amorphous ribbons (Metglas 2605SA3 alloy) and Fe x N (x = 2-4) powder. Crystalline Fe x N can serve as a high magnetic moment, high electrical resistance binder, and lamination material in the consolidation of amorphous and nanocrystalline ribbons, mitigating eddy currents while boosting magnetic performance and stacking factor in both wound and stacked soft magnetic cores. Stacking factors of nearly 100% can be achieved in an amorphous ribbon/iron nitride composite. FeSiCrB-Fe x N multilayered metallic glass composites prepared by spark plasma sintering have the potential to serve as a next-generation soft magnetic material in power electronics and electrical machines.

The size dependence of the dielectric constants of barium titanate or other ferroelectric particles can be explored by embedding particles into an epoxy matrix whose dielectric constant can be measured directly. However, to extract the particle dielectric constant requires a model of the composite medium. We compare a finite element model for various volume fractions and particle arrangements to several effective medium approximations, which do not consider particle arrangement explicitly. For a fixed number of particles, the composite dielectric constant increases with the degree of agglomeration, and we relate this increase to the number of regions of enhanced electric field along the applied field between particles in an agglomerate. Additionally, even for dispersed particles, we find that the composite method of assessing the particle dielectric constant may not be effective if the particle dielectric constant is too high compared to the background medium dielectric constant.

Soft magnetic materials are key to the efficient operation of the next generation of power electronics and electrical machines (motors and generators). Many new materials have been introduced since Michael Faraday's discovery of magnetic induction, when iron was the only option. However, as wide bandgap semiconductor devices become more common in both power electronics and motor controllers, there is an urgent need to further improve soft magnetic materials.These improvements will be necessary to realize the full potential in efficiency, size, weight, and power of high-frequency power electronics and high-rotational speed electrical machines. Here we provide an introduction to the field of soft magnetic materials and their implementation in power electronics and electrical machines. Additionally, we review the most promising choices available today and describe emerging approaches to create even better soft magnetic materials.