Publications

Vianco, P.T., Walker, C., de Smet, D., Kilgo, A.C., McKenzie, B., Grant, R.P., & Grant, R.P. (2018). Interface Reactions Responsible for Run-out in Active Brazing: Part 2. Welding Journal, 2018. https://www.osti.gov/biblio/1529300

Ghanbari, Z., Susan, D.F., Kilgo, A.C., Profazi, C.A., Heiden, M.J., & Heiden, M.J. (2018). Analysis of Defects in Tungsten Heavy Alloy [Conference Poster]. https://www.osti.gov/biblio/1593072

Yang, P., Rodriguez, M.A., Deibler, L.A., Jared, B.H., Griego, J.J.M., Kilgo, A.C., Allen, A., Stefan, D., & Stefan, D. (2018). Effect of thermal annealing on microstructure evolution and mechanical behavior of an additive manufactured AlSi10Mg part. Journal of Materials Research, 33(12), pp. 1701-1712. 10.1557/jmr.2018.82

Vianco, P.T., Kilgo, A.C., McKenzie, B., & McKenzie, B. (2018). Gold-Tin Solder Wetting Behavior for Package Lid Seals. Journal of Electronic Packaging, 140(2). 10.1115/1.4039749

Fonseca, J., Vackel, A., Wilson, L.C., Kilgo, A.C., Profazi, C.A., & Profazi, C.A. (2018). Porosity Measurement of Flame Sprayed Aluminum [Conference Poster]. https://www.osti.gov/biblio/1510670

Vianco, P.T., Williams, S.M., McKenzie, B., Kilgo, A.C., Walsh, M., Price, W., Guerrero, E., & Guerrero, E. (2018). The Mechanical Performance of Sn-Pb Solder Joints on LTCC Substrates [Conference Poster]. https://www.osti.gov/biblio/1508897

Vianco, P.T., Kilgo, A.C., McKenzie, B., Walsh, M., Price, W., Guerrero, E., & Guerrero, E. (2018). The Mechanical Performance of Sn-Pb Solder Joints on LTCC Substrates [Conference Poster]. https://www.osti.gov/biblio/1500158

Vianco, P.T., Walker, C., de Smet, D., Kilgo, A.C., McKenzie, B., Grant, R.P., & Grant, R.P. (2018). Interface Reactions Responsible for Run-Out in Active Brazing: Part 1. Welding Journal, 97(2). 10.29391/2018.97.004

Rodelas, J., Susan, D.F., Sorensen, N.R., Michael, J.R., Kilgo, A.C., McKenzie, B., & McKenzie, B. (2017). Failure of High-Strength Socket Head Cap Screws due to Incorrect Alloy [Conference Poster]. https://www.osti.gov/biblio/1510412

Susan, D.F., Norris, J.T., Kilgo, A.C., Williams, S.M., Lowery, L.M., & Lowery, L.M. (2017). Metallurgical Analysis of Pin-to-Flex Circuit Solder Joints [Conference Poster]. https://www.osti.gov/biblio/1468708

Vianco, P.T., Rejent, J.A., Kilgo, A.C., McKenzie, B., Neilsen, M.K., & Neilsen, M.K. (2016). predicting the reliability of package-on-package-on-package (popop) interconnections based on accelerated aging experiments and computational modeling [Conference Poster]. https://www.osti.gov/biblio/1427160

Vianco, P.T., Kilgo, A.C., Rejent, J.A., McKenzie, B., Neilsen, M.K., & Neilsen, M.K. (2016). Predicting the Reliability of Package-on-Package-Package (PoPoP) Interconnections Based on Accelerated Aging Experiments and Computational Modeling [Conference Poster]. https://www.osti.gov/biblio/1427155

Susan, D.F., Kilgo, A.C., Williams, S.M., & Williams, S.M. (2016). Flowforming of Austenitic Stainless Steel [Conference Poster]. https://www.osti.gov/biblio/1372025

Vianco, P.T., Rejent, J.A., Grazier, J.M., McKenzie, B., Allen, A., Kilgo, A.C., Guerrero, E., Price, W., & Price, W. (2015). Establishing a Ti-Cu-Pt-Au Thin Film Conductor on Low-Temperature Co-Fired Ceramic (LTCC) for High Temperature Electronics [Conference Poster]. https://www.osti.gov/biblio/1331960

Madison, J., Susan, D.F., Kilgo, A.C., & Kilgo, A.C. (2015). 3D RoboMET Characterization. 10.2172/1226519

Madison, J., Huffman, E.M., Poulter, G.A., Kilgo, A.C., & Kilgo, A.C. (2015). R3D at Sandia National Laboratories - A User Update [Presentation]. https://www.osti.gov/biblio/1324594

Adams, D.P., Reedlunn, B., Bishop, J.E., Carroll, J.D., Maguire, M.C., Song, B., Wise, J.L., Brown, D., Clausen, B., Palmer, T., Kilgo, A.C., & Kilgo, A.C. (2015). Mechanical Response of Additively Manufactured (AM) Stainless Steel 304L across a Wide Range of Strain Rates [Conference Poster]. https://www.osti.gov/biblio/1531070

Vianco, P.T., Walker, C., de Smet, D., Kilgo, A.C., McKenzie, B., Kotula, P.G., Grant, R.P., & Grant, R.P. (2015). Understanding the Run-out Behavior of a Ag-Cu-Zr Braze Alloy When Used to Join Alumina to an Fe-Ni-Co Alloy [Conference Poster]. https://www.osti.gov/biblio/1247092

Vianco, P.T., Walker, C., de Smet, D., Kilgo, A.C., McKenzie, B., Kotula, P.G., Grant, R.P., & Grant, R.P. (2015). Understanding the Run-out Behavior of a Ag-Cu-Zr Braze Alloy When Used to Join Alumina to an Fe-Ni-Co Alloy [Conference Poster]. https://www.osti.gov/biblio/1248707

Ewsuk, K.G., Newton, C.S., Kilgo, A.C., Bencoe, D.N., Haggerty, R.P., Hilton, M., Tandon, R., Christensen, J., & Christensen, J. (2014). Glass Density Effects in Glass-To-Metal Sealing [Presentation]. https://www.osti.gov/biblio/1241768

Sarobol, P., Vianco, P.T., Peterson, K.A., Rejent, J.A., Grazier, J.M., Profazi, C.A., Kilgo, A.C., McKenzie, B., Wolf, A., & Wolf, A. (2014). Accelerated aging and testing of thin films on LTCC test vehicles [Conference Poster]. https://www.osti.gov/biblio/1241762

Sarobol, P., Vianco, P.T., Peterson, K.A., Rejent, J.A., Grazier, J.M., Profazi, C.A., Kilgo, A.C., McKenzie, B., Wolf, A., & Wolf, A. (2014). Accelerated aging and testing of thin films on LTCC test vehicles [Presentation]. https://www.osti.gov/biblio/1241754

Vianco, P.T., Rejent, J.A., Kilgo, A.C., Garrett, S.E., & Garrett, S.E. (2014). Sensitivity of Copper Dissolution to the Flow Behavior of Molten Sn-Pb Solder [Presentation]. https://www.osti.gov/biblio/1576086

Huffman, E.M., Kilgo, A.C., Poulter, G.A., Madison, J., & Madison, J. (2014). RoboMET.3D @ Sandia National Laboratories; A Unique System A Unique Capability [Presentation]. https://www.osti.gov/biblio/1502657

Sarobol, P., Vianco, P.T., Peterson, K.A., Rejent, J.A., Grazier, J.M., Profazi, C.A., Kilgo, A.C., McKenzie, B., & McKenzie, B. (2014). ACCELERATED AGING AND TESTING OF THIN FILM TEST VEHICLES WITH Ag AND Au TKN PASTE [Presentation]. https://www.osti.gov/biblio/1497768

Susan, D.F., Sorensen, N.R., Michael, J.R., Kilgo, A.C., Clark, G.L., & Clark, G.L. (2014). Steel Lug Nut Failures with Brittle Fracture Characteristics [Presentation]. 10.1017/S1431927614011040

Vianco, P.T., Rejent, J.A., Kilgo, A.C., Garrett, S.E., & Garrett, S.E. (2014). SENSITIVITY OF COPPER DISSOLUTION TO THE FLOW BEHAVIOR OF MOLTEN SN-PB SOLDER [Conference Poster]. https://www.osti.gov/biblio/1315661

Walker, C., McKenzie, B., Kilgo, A.C., Crenshaw, T.B., de Smet, D., & de Smet, D. (2013). Run-out Phenomenon in Ag-Cu-Zr Active Braze Joints Made Between Alumina and an Fe-Ni-Co Alloy [Conference]. https://www.osti.gov/biblio/1120376

Neilsen, M.K., Rejent, J.A., Grazier, J.M., Kilgo, A.C., & Kilgo, A.C. (2013). Predicting the Reliability Of Package-on-Package Interconnections Using Computational Modeling [Conference]. https://www.osti.gov/biblio/1140539

Vianco, P.T., Neilsen, M.K., Rejent, J.A., Grazier, J.M., Kilgo, A.C., & Kilgo, A.C. (2013). PREDICTING THE RELIABILITY OF PACKAGE-ON-PACKAGE INTERCONNECTIONS USING COMPUTATIONAL MODELING SOFTWARE [Conference]. https://www.osti.gov/biblio/1106678

Rejent, J.A., Grazier, J.M., Duran, P., Kilgo, A.C., McKenzie, B., Allen, A., & Allen, A. (2013). A Pin Pull Test A Pin Pull Test to Assess the Adhesion of Thin Film Conductors on LTCC Substrates [Conference]. https://www.osti.gov/biblio/1106394

Sorensen, N.R., Robinson, D.G., Granata, J.E., Burton, P.D., Taylor, J.M., Kilgo, A.C., & Kilgo, A.C. (2013). Reliability Model Development for Photovoltaic Connector Lifetime Prediction Capabilities [Conference]. https://doi.org/10.1109/PVSC.2013.6744115

Sorensen, N.R., Granata, J.E., Yang, B.B., Vianco, P.T., Holliday, M., Neilsen, M.K., Kilgo, A.C., Rejent, J.A., Grazier, J.M., Johnson, J., & Johnson, J. (2013). use of TurboSiP Software to Predict the Long-Term Reliaility of Solder Joints on Photovoltaic Systems [Conference]. https://www.osti.gov/biblio/1083089

Sorensen, N.R., Vianco, P.T., Holliday, M., Neilsen, M.K., Kilgo, A.C., Rejent, J.A., Grazier, J.M., Johnson, J., Granata, J.E., & Granata, J.E. (2013). Use of the TurboSiP(C) Software to Predict the Long-Term Reliability of Solder Joints on Photovoltaic Systems [Presentation]. https://www.osti.gov/biblio/1115477

Cruz-Campa, J.L., Haase, G.S., Colr, E.I., Tangyunyong, P., Resnick, P., Okandan, M., Nielson, G.N., Kilgo, A.C., & Kilgo, A.C. (2013). Copy of Failure Analysis and Reliability Model Development for Microsystems-Enabled Photovoltaics [Conference]. https://www.osti.gov/biblio/1083665

Sorensen, N.R., Robinson, D.G., Granata, J.E., Burton, P.D., Taylor, J.M., Kilgo, A.C., & Kilgo, A.C. (2013). Reliability Model Development for Photovoltaic Connector Lifetime Prediction Capabilities [Conference]. 10.1109/PVSC.2013.6744115

Rejent, J.A., Kilgo, A.C., Garrett, S.E., Vianco, P.T., & Vianco, P.T. (2013). Sensitivity of Copper Dissolution to the Flow Behavior of Molten Sn-Pb Solder. Solder and Surface Mount Technology. https://www.osti.gov/biblio/1145406

Kilgo, A.C., Reece, M., Ghanbari, Z., & Ghanbari, Z. (2013). Quantitative Metallography of Discontinuous Precipitation in Pd-Rich Precious Metal Alloys [Conference]. https://www.osti.gov/biblio/1073203

Nielson, G.N., Okandan, M., Resnick, P., Sanchez, C.A., Yang, B.B., Kilgo, A.C., Ford, C.L., Nelson, J., & Nelson, J. (2013). Ultra-thin single crystal silicon modules capable of 450 W/kg and bending radii <1mm: Fabrication and characterization [Conference]. Conference Record of the IEEE Photovoltaic Specialists Conference. https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84896445494&origin=inward

Nielson, G.N., Okandan, M., Resnick, P., Sanchez, C.A., Yang, B.B., Kilgo, A.C., Ford, C.L., Nelson, J., & Nelson, J. (2013). Ultra-thin single crystal silicon modules capable of 450 W/kg and bending radii <1mm: Fabrication and characterization [Conference]. Conference Record of the IEEE Photovoltaic Specialists Conference. https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84896445494&origin=inward

Vianco, P., Rejent, J.A., Grazier, J.M., Kilgo, A.C., & Kilgo, A.C. (2012). Creep behavior of a Sn-Ag-Bi Pb-free solder. Materials, 5(11), pp. 2151-2175. https://doi.org/10.3390/ma5112151

Grant, R.P., Rejent, J.A., Crenshaw, T.B., Kilgo, A.C., & Kilgo, A.C. (2012). Ag-Au-Ge alloys for high temperature geothermal and oil well electronics applications [Conference]. https://www.osti.gov/biblio/1104767

Grant, R.P., Rejent, J.A., Crenshaw, T.B., Kilgo, A.C., & Kilgo, A.C. (2012). Ag-Au-Ge alloys for high temperature geothermal and oil well electronics applications [Conference]. https://www.osti.gov/biblio/1104774

Vianco, P.T., Kilgo, A.C., Wroblewski, B., Zender, G., Guerrero, E., & Guerrero, E. (2012). Accelerated aging of Sn-Pb and Pb-free solder joints on hybrid microcircuit assemblies [Conference]. IBSC 2012 - Proceedings of the 5th International Brazing and Soldering Conference. https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84862141977&origin=inward

Kilgo, A.C., Wroblewski, B., Zender, G., & Zender, G. (2012). Accelerated Aging of Sn-Pb and Pb-free Solder Joints on Hybrid Microcircuit Assemblies [Conference]. https://www.osti.gov/biblio/1117431

Vianco, P.T., Kilgo, A.C., Grant, R.P., & Grant, R.P. (2011). Failure analysis of crimp connectors [Conference]. https://www.osti.gov/biblio/1288669

Vianco, P.T., Zender, G., Kilgo, A.C., & Kilgo, A.C. (2011). Robustness and Versatilityof Thin Films onLow Temperature Cofired Ceramic (LTCC) [Conference]. https://www.osti.gov/biblio/1106809

Vianco, P.T., Zender, G., Kilgo, A.C., & Kilgo, A.C. (2011). Thin Film on LTCC for Connectivity and Conductivity [Conference]. https://www.osti.gov/biblio/1108497

Vianco, P.T., Kilgo, A.C., Grant, R.P., & Grant, R.P. (2011). Failure Analysis of Crimp Connectors [Conference]. https://www.osti.gov/biblio/1109013

Robino, C.V., Reece, M., Kilgo, A.C., Ghanbari, Z., & Ghanbari, Z. (2011). Investigation of the Effects of Heat Treating on a Precious Metal Alloy [Conference]. https://www.osti.gov/biblio/1109393

Vianco, P.T., Grazier, J.M., Rejent, J.A., Kilgo, A.C., & Kilgo, A.C. (2010). Temperature cycling of Pb-free and mixed solder interconnections used on a package-on-package test vehicle [Conference]. https://www.osti.gov/biblio/1028406

Vianco, P.T., Kilgo, A.C., Zender, G., Rejent, J.A., & Rejent, J.A. (2010). Pull strength and failure mode analysis of thick film conductors on alumina ceramic for hybrid microcircuit technologies [Conference]. https://www.osti.gov/biblio/1028393

Robino, C.V., Reece, M., Kilgo, A.C., & Kilgo, A.C. (2010). Heat treatment and processing effects on precious metal electrical contact alloys [Conference]. https://www.osti.gov/biblio/1028423

Vianco, P.T., Grazier, J.M., Rejent, J.A., Kilgo, A.C., & Kilgo, A.C. (2010). Temperature cycling of PB-free and mixed solder interconnections used on a package-on-package test vehicle [Conference]. https://www.osti.gov/biblio/1022966

Vianco, P.T., Rejent, J.A., George, C., Kilgo, A.C., & Kilgo, A.C. (2010). Compression stress-strain behavior of Sn-Ag-Cu solders [Conference]. Journal of Electronic Materials. https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=74449090757&origin=inward

Zender, G., Kilgo, A.C., & Kilgo, A.C. (2008). Effect of Base Material and Plating Layers on the Mechanical Strength of Au-Sn Solder Bonds [Conference]. https://www.osti.gov/biblio/1142490

Vianco, P.T., Kilgo, A.C., Zender, G., Rejent, J.A., Grazier, J.M., & Grazier, J.M. (2008). An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates. 10.2172/942186

Kilgo, A.C., Zender, G., & Zender, G. (2007). Case Study: Failure Analysis of Solder Joints on a Connector Assembly [Conference]. https://www.osti.gov/biblio/1146270

Neilsen, M.K., Vianco, P.T., Kilgo, A.C., & Kilgo, A.C. (2007). The Effect of Partial Solder Filling on Thermal-Mechanical Fatigue of Cu-Plated Through Holes. International Journal of Materials and Structural Integrity. https://www.osti.gov/biblio/1146157

Rejent, J.A., Kilgo, A.C., Normann, R.A., & Normann, R.A. (2007). Electronics and Interconnection Materials for High and Ultra-High Temperature Applications [Presentation]. https://www.osti.gov/biblio/1716668

Vianco, P.T., Kilgo, A.C., Rejent, J.A., & Rejent, J.A. (2007). Soldering Technology for High and Ultra High Temperature Service [Conference]. https://www.osti.gov/biblio/1148152

Vianco, P.T., Rejent, J.A., Kilgo, A.C., & Kilgo, A.C. (2006). Microstructural evolution in electronic 63Sn-37Pb/Cu solder joints [Conference]. Proceedings of the 3rd International Brazing and Soldering Conference. https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=33751434097&origin=inward

Rejent, J.A., Kilgo, A.C., & Kilgo, A.C. (2006). Compression Creep of the 95.5Sn - (4.3 3.9 3.8)Ag - (0.2 0.6 0.7)Cu Solders [Conference]. https://www.osti.gov/biblio/1264074

Rejent, J.A., Kilgo, A.C., & Kilgo, A.C. (2006). Compression Creep Behavior of the 95.5Sn-(4.3 3.9 3.8)Ag-(0.2 0.6 0.7)Cu Solders [Conference]. https://www.osti.gov/biblio/1264073

Vianco, P.T., Kilgo, A.C., Zender, G., Hlava, P.F., & Hlava, P.F. (2006). An evaluation of the spring finger solder joints on SA1358-10 and SA2052-4 connector assemblies (MC3617,W87). 10.2172/889947

Kilgo, A.C., Grant, R.P., McKenzie, B., Zender, G., & Zender, G. (2006). Fatigue Failures of Fasteners: Optical Metallography and SEM Fractography [Conference]. https://www.osti.gov/biblio/1264282

Roach, R.A., Kilgo, A.C., Susan, D.F., van Ornum, D.J., & van Ornum, D.J. (2006). A Science-Based Understanding of Cermet Processing. 10.2172/1126942

Watson, C.S., Kilgo, A.C., Ernest, T.L., Monroe, S.L., Tuttle, B., Olson, W.R., & Olson, W.R. (2006). Failure analysis of rutile sleeves in MC3080 lightning arrestor connectors. 10.2172/883464

Buttry, R., Lopez, E., Kilgo, A.C., Lucero, S., & Lucero, S. (2005). Effects of Accelerated Storage Environments on the Solderability of Immersion Silver-Coated Printed Circuit Boards [Conference]. https://www.osti.gov/biblio/1465848

Susan, D.F., Kilgo, A.C., Crenshaw, T.B., Grant, R.P., Wright, R.D., & Wright, R.D. (2005). Quantitative Fractography of 17-4-PH Stainless Steel Investment Castings [Conference]. https://www.osti.gov/biblio/1120895

Susan, D.F., Crenshaw, T.B., Grant, R.P., Kilgo, A.C., Wright, R.D., & Wright, R.D. (2005). Effect of porosity on ductility variation in investment cast 17-4PH [Conference]. https://www.osti.gov/biblio/986089

Kilgo, A.C. (2005). Metallurgical failure analysis of a propane tank boiling liquid expanding vapor explosion (BLEVE). Proposed for publication in the Journal of Failure Analysis and Prevention.. https://www.osti.gov/biblio/952140

Susan, D.F., Kilgo, A.C., Vianco, P.T., & Vianco, P.T. (2004). Metallography of solders and soldered interconnections for electronic packaging applications [Conference]. https://www.osti.gov/biblio/959298

Vianco, P.T., Rejent, J.A., Zender, G., Kilgo, A.C., & Kilgo, A.C. (2003). Kinetics of Pb-rich phase particle coarsening in Sn-Pb solder under isothermal aging : cooling rate dependence. Proposed for publication in Journal of Materials Science.. https://www.osti.gov/biblio/923592

Vianco, P.T., Kilgo, A.C., & Kilgo, A.C. (2000). The impact of process parameters on gold elimination from soldered connector assemblies. Assembly Automation. 10.1108/09540910010331400