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Schmitt, R., Menk, L., Baca, E., Jordan, M., Hollowell, A.E., Jackson, N., Romero, J.A., & Bower, J.E. (2021). Void-free copper electrodeposition in high aspect ratio, full wafer thickness through-silicon vias with endpoint detection. Journal of the Electrochemical Society, 167(16). https://doi.org/10.1149/1945-7111/abd56e

Bolintineanu, D.S., Rao, R.R., Lechman, J.B., Romero, J.A., Jove-Colon, C.F., Quintana, E.C., Bauer, S.J., & Ingraham, M.D. (2017). Simulations of the effects of proppant placement on the conductivity and mechanical stability of hydraulic fractures. International Journal of Rock Mechanics and Mining Sciences, 100(C), pp. 188-198. 10.1016/j.ijrmms.2017.10.014

Madison, J., Foulk, J.W., Swiler, L.P., Boyce, B.L., Jared, B.H., Rodelas, J., Salzbrenner, B., Webb, K., Jacques, C.L., Romero, J.A., Kernen, B.L., & Moore, D.G. (2017). Corroborating Tomographic Defect Metrics with Processing Parameters & Mechanical Response in Metal AM [Conference Poster]. https://www.osti.gov/biblio/1462531

4 Results
4 Results