Publications

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Quasi-static structural finite-element models of an aluminum-framed crystalline silicon photovoltaic module and a glass-glass thin-film module were constructed and validated against experimental measurements of deflection under uniform pressure loading. Specific practices in the computational representation of module assembly were identified as influential to matching experimental deflection observations. Additionally, parametric analyses using Latin hypercube sampling were performed to propagate input uncertainties related to module materials, dimensions, and tolerances into uncertainties in simulated deflection. Sensitivity analyses were performed on the uncertainty quantification datasets using linear correlation coefficients and variance-based sensitivity indices to elucidate key parameters influencing module deformation. Results identified edge tape and adhesive material properties as being strongly correlated to module deflection, suggesting that optimization of these materials could yield module stiffness gains at par with the conventionally structural parameters, such as glass thickness. This exercise verifies the applicability of finite-element models for accurately predicting mechanical behavior of solar modules and demonstrates a workflow for model-based parametric uncertainty quantification and sensitivity analysis. Applications of this capability include the assessment of field environment loads, derivation of representative loading conditions for reduced-scale testing, and module design optimization, among others.

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Static structural finite element models of an aluminum-framed crystalline silicon (c-Si) photovoltaic (PV) module and a glass-glass thin film PV module were constructed and validated against experimental measurements of deflection under uniform pressure loading. Parametric analyses using Latin Hypercube Sampling (LHS) were performed to propagate simulation input uncertainties related to module material properties, dimensions, and manufacturing tolerances into expected uncertainties in simulated deflection predictions. This exercise verifies the applicability and validity of finite element modeling for predicting mechanical behavior of solar modules across architectures and enables computational models to be used with greater confidence in assessment of module mechanical stressors and design for reliability. Sensitivity analyses were also performed on the uncertainty quantification data sets using linear correlation coefficients to elucidate the key parameters influencing module deformation. This information has implications on which materials or parameters may be optimized to best increase module stiffness and reliability, whether the key optimization parameters change with module architecture or loading magnitudes, and whether parameters such as frame design and racking must be replicated in reduced-scale reliability studies to adequately capture full module mechanical behavior.

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A computational study was performed to assess influences of geometric design parameters and material properties on thermally induced interfacial stresses within a packaged solar cell assembly. A Latin Hypercube Sampling approach was used, varying 36 total geometric, initial condition, and material property parameters representative of available solar cell designs, to assess the sensitivity of computed interfacial stresses to each input. Simulations consisted of a laminated 3D assembly of two cells connected by an interconnect ribbon, with resolution of the glass, encapsulant, ribbon, solder, cell, and backsheet, cycled through a temperature change of - 40°C to 85 °C. Geometry and mesh creation were automated to enable sampling over varying cell designs. The purpose of this study was to develop a methodology to investigate the interplay between cell designs and thermally induced stresses, particularly those occurring over component interfaces subject to delamination. Information on the expected drivers of interfacial stresses as well as the primary directions in which stresses arise will better define interface adhesion tests and inform accelerated stress testing to more completely characterize delamination phenomena.

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