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Vianco, P.T., Neilsen, M.K., & Neilsen, M.K. (2007). Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn-3.9Ag-0.6Cu Lead-Free Solder. IEEE Journal of Electronic Packaging. https://www.osti.gov/biblio/1147408

Vianco, P.T., Rejent, J.A., Grazier, J.M., & Grazier, J.M. (2007). Validation of a general fatigue life prediction methodology for Sn-Ag-Cu lead-free solder alloy interconnects. Proposed for publication in the IEEE Journal of Electronic Packaging.. https://www.osti.gov/biblio/913229

Blanchat, T.K., Dobranich, D., & Dobranich, D. (2007). Large-Scale Testing and High-Fidelity Simulation Capabilities at Sandia National Laboratories to Support Space Power and Propulsion [Conference]. https://www.osti.gov/biblio/1147474

Results 81151–81200 of 99,299
Results 81151–81200 of 99,299