Publications

This report proposes the first stage of a Quality Framework approach that can be used to evaluate and document Component Material Evaluation (CME) projects. The first stage of the Quality Framework defines two tools that will be used to evaluate a CME project. The first tool is used to decompose a CME project into its essential elements. These elements can then be evaluated for inherent quality by looking at the subelements that impact their level of quality maturity or rigor. Quality Readiness Levels (QRLs) are used to valuate project elements for inherent quality. The Framework provides guidance for the Principal Investigator (PI) and stakeholders for CME project prerequisites that help to ensure the proper level of confidence in the deliverable given its intended use. The Framework also Provides a roadmap that defined when and how the Framework tools should be applied. Use of these tools allow the Principal Investigator (PI) and stakeholders to understand what elements the project will use to execute the project, the inherent quality of the elements, which of those are critical to the project and why, and the risks associated to the project's elements.

SUMMiT (Sandia Ultra-planar Multi-level MEMS Technology) at the Sandia National Laboratories' MDL (Microelectronics Development Laboratory) is a standardized MEMS (Microelectromechanical Systems) technology that allows designers to fabricate concept prototypes. This technology provides four polysilicon layers plus three sacrificial oxide layers (with the third oxide layer being planarized) to enable fabrication of complex mechanical systems-on-a-chip. Quantified reproducibility of the SUMMiT process is important for process engineers as well as designers. Summary statistics for critical MEMS technology parameters such as film thickness, line width, and sheet resistance will be reported for the SUMMiT process. Additionally, data from Van der Pauw test structures will be presented. Data on film thickness, film uniformity and critical dimensions of etched line widths are collected from both process and monitor wafers during manufacturing using film thickness metrology tools and SEM tools. A standardized diagnostic module is included in each SWiT run to obtain post-processing parametric data to monitor run-to-run reproducibility such as Van der Pauw structures for measuring sheet resistance. This characterization of the SUMMiT process enables design for manufacturability in the SUMMiT technology.