Publications Details
Understanding the reliability of solder joints used in advanced structural and electronics applications: Part 1 - Filler Metal Properties and the Soldering Process: The effects of filler metal properties and the soldering process on joint reliability were examined
Soldering technology has made tremendous strides in the past half-century. Whether structural or electronic, all solder joints must provide a level of reliability that is required by the application. This Part 1 report examines the effects of filler metal properties and the soldering process on joint reliability. Solder alloy composition must have the appropriate melting and mechanical properties that suit the product's assembly process(es) and use environment. The filler metal must also optimize solderability (wetting and spreading) to realize the proper joint geometry. The soldering process also affects joint reliability. The choice of flux and thermal profile support the solderability performance of the molten filler metal to successfully fill the joint clearance and complete the fillet. Base material and/or surface finish dissolution can alter the filler metal composition, which together with the interface reaction, affect the long-term mechanical performance of the solder joint. A second report, Part 2, explores the factors that explicitly affect solder joint: reliability, including solid-state growth of the solder/base material reaction layer as well as solder joint fatigue under cyclic loading environments.