Publications Details

Computational modeling of on-demand solder delivery for fluxless MCM packaging applications

Essien, M.

The development of smaller circuit volumes in microelectronic applications, particularly Multichip Module (MCM) technology, entails deposition of minute quantities of solder, with volumes on the order of nanoliters. We propose a system for fluxless solder deposition which uses on-demand solder jetting for deposition of 200 micrometer diameter solder droplets onto aluminum pads. This work details the computational modeling performed to provide design parameters for a magneto-hydrodynamic solder jetter (MHD). A dimensionless analysis was used to relate the fluid properties, the orifice length and width, and the droplet size to the amplitude and duration of the pressure pulse. These results were used as the initial inputs for the fluid dynamics model, and subsequent iterations were performed to determine the operational parameters that lead to the formation of stable, single droplets. Results show that a maximum pulse amplitude on the order of 0.5 Mdynes/cm[sup 2] is necessary to dispense molten solder from a 200 micrometer diameter orifice. The size of the droplet was found to vary linearly with the applied pressure pulse. The duration of the pulse ranged from approximately 0.6 to 0.9 milliseconds. A theoretical description of the relationship between the orifice diameter, surface tension, and `Pinch-off` time is given, and is in agreement with the results of the computational model.