Publications

Results 76801–76850 of 99,299

Search results

Jump to search filters

Cygan, R.T., Jiang, Y., Alam, T.M., Brinker, C.J., Bunker, B.C., Leung, K., Nenoff, T.M., Nyman, M.D., Ockwig, N., Orendorff, C., Rempe, S., Singh, S., Criscenti, L., Stevens, M.J., Thurmer, K., van Swol, F.B., Varma, S., Crozier, P., Feibelman, P.J., … Huber, D.L. (2008). Exploiting interfacial water properties for desalination and purification applications. https://doi.org/10.2172/942190

Vianco, P.T., Kilgo, A.C., Zender, G., Rejent, J.A., & Grazier, J.M. (2008). An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates. 10.2172/942186

Moffat, H.K., Sun, A., Enos, D., Serna, L.M., Sorensen, N.R., & Battaile, C.C. (2008). Modeling pore corrosion in normally open gold- plated copper connectors. 10.2172/942183

Torczynski, J.R., Gallis, M.A., Piekos, E.S., Serrano, J.R., Phinney, L., & Gorby, A.D. (2008). Validation of thermal models for a prototypical MEMS thermal actuator. 10.2172/942182

Childs, K.D., Ten Eyck, G.A., Tracy, L.A., Stevens, J., Wendt, J.R., Lilly, M., Carroll, M.S., & Gurrieri, T. (2008). Steps toward fabricating Cryogenic CMOS Compatible Single Electron Devices [Presentation]. 10.1109/NANO.2008.149

Results 76801–76850 of 99,299
Results 76801–76850 of 99,299