Publications

Kopatz, J.W., Reinholtz, W.D., Cook, A., Tappan, A.S., Grillet, A.M., & Grillet, A.M. (2023). Pressure-based process monitoring of direct-ink write material extrusion additive manufacturing. Additive Manufacturing, 80. 10.1016/j.addma.2023.103928

Grillet, A.M., Kopatz, J.W., Reinholtz, W.D., Leonard, J.C., Tappan, A.S., Cook, A., & Cook, A. (2023). In Situ Process Monitoring of Direct Ink Write Material Extrusion Additive Manufacturing [Conference Presenation]. 10.2172/2430730

Kopatz, J.W., Reinholtz, W.D., Leonard, J.C., Tappan, A.S., Cook, A., Grillet, A.M., & Grillet, A.M. (2022). Rheological Behavior & Process Monitoring of Highly Filled Direct-Ink Write Pastes [Conference Presenation]. 10.2172/2005363

Roach, D.J., Rohskopf, A.D., Reinholtz, W.D., Appelhans, L., Cook, A., & Cook, A. (2022). Real-Time Process Modeling & Control of Direct Ink Write 3D Printing using Computer Vision and Machine Learning [Conference Poster]. 10.2172/2004311

Roach, D.J., Reinholtz, W.D., Appelhans, L., Cook, A., & Cook, A. (2022). Real-Time Process Monitoring of Additively Manufactured Components Using Computer Vision & Artificial Intelligence [Conference Presenation]. 10.2172/2002520

Roach, D.J., Rohskopf, A., Hamel, C., Reinholtz, W.D., Bernstein, R., Qi, H.J., Cook, A., & Cook, A. (2021). Utilizing computer vision and artificial intelligence algorithms to predict and design the mechanical compression response of direct ink write 3D printed foam replacement structures. Additive Manufacturing, 41. 10.1016/j.addma.2021.101950

Haggerty, R.P., Cook, A., Copeland, R., Esfahani, S.S., Finnegan, P.S., Fuller, N., Koplow, J., Schoeniger, J.S., Hinchcliffe, J.C., Reese, T., Foulk, J.W., Lynch, J.J., Glen, A., Cahill, J., Sanchez, A.L., Sinclair, M.B., Gallegos, M.A., Carney, J., Ho, D., … Arrowsmith, M.D. (2020). CPAP Ventilators Needed for Rapid Response to COVID-19 by Modification of CPAP Equipment. 10.2172/1668131

Herman, D.J., Cook, A., Montoya, B.M., Reinholtz, W.D., Harbour, T., Johnson, R., Allcorn, E., & Allcorn, E. (2020). Printable Ink Development for Molten Salt Battery Electrodes [Conference Poster]. https://www.osti.gov/biblio/1821832

Appelhans, L., Kopatz, J.W., Reinholtz, W.D., Cook, A., & Cook, A. (2020). Approaches to Thermoset Resins for Direct-Ink-Write Additive Manufacturing [Presentation]. https://www.osti.gov/biblio/1814696

Appelhans, L., Kopatz, J.W., Unangst, J.L., Reinholtz, W.D., Cook, A., & Cook, A. (2020). Approaches to Thermoset Resins for Direct-Ink-Write Additive Manufacturing [Conference Poster]. https://www.osti.gov/biblio/1770267

Kopatz, J.W., Reinholtz, W.D., Cook, A., Appelhans, L., & Appelhans, L. (2020). Cure Behavior and Thermo-Mechanical Properties of Dual-Cure Thermoset Resins Containing Functionalized Fillers [Conference Poster]. https://www.osti.gov/biblio/1770546

Appelhans, L., Cook, A., Kopatz, J.W., Unangst, J.L., Reinholtz, W.D., & Reinholtz, W.D. (2020). Polymer Network Formation in Epoxy/Acrylate Dual-Cure Thermoset Resins for Direct Ink Write Additive Manufacturing [Conference Poster]. https://www.osti.gov/biblio/1783575

Jared, B.H., Cook, A., Choi, J., Reinholtz, W.D., Saiz, D.J., Arrington, C.L., Baca, K., & Baca, K. (2019). Ceramaic Additive Manufacturing of a Simple Plano Mirror [Conference Poster]. https://www.osti.gov/biblio/1643039

Gallegos, M.A., Kaufman, G., Reinholtz, W.D., Cook, A., Kaehr, B.J., & Kaehr, B.J. (2019). Realizing Rugged and Conformable Printed Devices via In-Mold-Electronics [Conference Poster]. https://www.osti.gov/biblio/1642173

Reuel, P.C., Reinholtz, W.D., Boyle, T., & Boyle, T. (2019). Reduction of Metal Acetylacetonates (acac) Utilizing Lithium Metal Hydrides [Conference Poster]. https://www.osti.gov/biblio/1642568

Lavin, J.M., Keicher, D., Evans, L., Mani, S., Wirth, A.J., Whetten, S.R., Foulk, J.W., Reinholtz, W.D., Cook, A., & Cook, A. (2019). A Modular Direct Write Additive Manufacturing Approach in the Printing of Multi-Materials and Alumina [Conference Poster]. https://www.osti.gov/biblio/1642164

Kopatz, J.W., Reinholtz, W.D., Appelhans, L., Cook, A., & Cook, A. (2019). IN-SITU PRESSURE MONITORING OF DUAL-CURE THERMOSET RESINS FOR DIRECT-INK WRITING [Conference Poster]. https://www.osti.gov/biblio/1641990

Kopatz, J.W., Beasley, S., Reinholtz, W.D., Cook, A., Appelhans, L., & Appelhans, L. (2019). Rheological and Mechanical Behavior of Dual-Cure DIW Resins [Conference Poster]. https://www.osti.gov/biblio/1641632

Bell, N.S., Cook, A., Boyle, T., Fan, H., Gallegos, M.A., Hernandez-Sanchez, B.A., Kaehr, B.J., Reinholtz, W.D., Schunk, P.R., Secor, E.B., Treadwell, L.J., & Treadwell, L.J. (2019). Advanced Manufacturing of Electronics for Autonomous Safety Devices at the AML [Conference Poster]. https://www.osti.gov/biblio/1601548

Celina, M.C., Campbell, C., Cook, A., Reinholtz, W.D., McElhanon, J.R., & McElhanon, J.R. (2018). Additive Manufacturing of Low Density Thermoplastic Materials [Conference Poster]. https://www.osti.gov/biblio/1529777

Perales, D., Bell, N.S., Cook, A., Treadwell, L.J., Hattar, K., Reinholtz, W.D., & Reinholtz, W.D. (2018). Precursor development of iron nanopowders for nanoink Aerosol Jet 3D printing [Conference Poster]. https://www.osti.gov/biblio/1503095

Diantonio, C., Cook, A., Chavez, T.P., Evans, L., Reinholtz, W.D., Meyer, K.C., & Meyer, K.C. (2018). Ceramic feedstock for ?Additive? Manufacturing [Conference Poster]. https://www.osti.gov/biblio/1497572

Diantonio, C., Cook, A., Chavez, T.P., Evans, L., Reinholtz, W.D., Meyer, K.C., & Meyer, K.C. (2017). Ceramic feedstock for ?Additive? Manufacturing [Conference Poster]. https://www.osti.gov/biblio/1507946

Lavin, J.M., Evans, L., Keicher, D., Reinholtz, W.D., Mani, S., & Mani, S. (2017). A Demonstration of the Direct Write Printing of Ceramics [Conference Poster]. https://www.osti.gov/biblio/1456505

Jared, B.H., Chavez, T.P., Choi, J., Cook, A., Diantonio, C., Reinholtz, W.D., Saavedra, M.P., Saiz, D.J., Winrow, E.G., & Winrow, E.G. (2016). Additive manufacturing of reflective optical components [Conference Poster]. Proceedings - 32nd ASPE Annual Meeting. https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85040326114&origin=inward