Publications

Wheeling, R., Vianco, P., Williams, S.M., Jauregui, L., Gallis, D.F.S., & Gallis, D.F.S. (2022). Impact of Gold Thickness on Interfacial Evolution and Subsequent Embrittlement of Tin–Lead Solder Joints. Journal of Electronic Materials, 51(12), pp. 7337-7352. 10.1007/s11664-022-09891-2

Wheeling, R. (2022). Indium Interconnect Mechanical Performance with Variable UBM and Decreasing Bump Size [Conference Paper]. https://www.osti.gov/biblio/2005709

Rogers, T.J., Strong, K.T., Grutzik, S.J., Foulk, J.W., Wheeling, R., & Wheeling, R. (2022). Soldered Tensile Failure Stress of Ceramics in Multilayered Ceramic Capacitors [Conference Poster]. 10.2172/2005673

Wheeling, R. (2022). Indium Interconnect Mechanical Performance with Variable UBM and Decreasing Bump Size [Conference Presenation]. https://doi.org/10.2172/2005649

Wheeling, R. (2022). Case Study: Metallurgical and Mechanical Analysis of Castellated Via Rigid-Flex Connection [Conference Presenation]. 10.2172/2005396

Wheeling, R. (2022). Case Study: Metallurgical and Mechanical Analysis of Castellated Via Rigid-Flex Connection [Conference Paper]. https://www.osti.gov/biblio/2004865

Jauregui, L., Wheeling, R., Foulk, J.W., & Foulk, J.W. (2022). Quantifying Pb in Microelectronic Electrodes to Mitigate Sn Whisker Growth With The Use of Energy Dispersive X-Ray Spectroscopy (EDS) and Image Analysis [Conference Poster]. 10.2172/2004123

Wheeling, R. (2022). Metallurgy Impacting Reliability: Intermetallic Growth Kinetics of Indium Microbumps [Conference Presenation]. 10.2172/2003652

Foulk, J.W., Foulk, J.W., Dalton, G., Wheeling, R., Foulk, J.W., Thompson, K., Foulk, J.W., Jimenez, E.S., & Jimenez, E.S. (2022). Design and fabrication of multi-metal patterned target anodes for improved quality of hyperspectral X-ray radiography and computed tomography imaging systems [Conference Proceeding]. Proceedings of SPIE - The International Society for Optical Engineering. 10.1117/12.2631785

Foulk, J.W., Foulk, J.W., Dalton, G., Wheeling, R., Foulk, J.W., Thompson, K., Foulk, J.W., Jimenez, E.S., & Jimenez, E.S. (2022). Design and fabrication of multi-metal patterned target anodes for improved quality of hyperspectral X-ray radiography and computed tomography imaging systems [Conference Presenation]. Proceedings of SPIE - The International Society for Optical Engineering. https://doi.org/10.2172/2004456

Wheeling, R. (2021). Solderability of Additively Manufactured Copper Surfaces [Conference Paper]. 10.37665/smt.v36i3.32

Wheeling, R. (2021). Natural and Accelerated Aging Effect on Tin-Lead-Antimony Solder Microstructure and Mechanical Properties [Conference Presenation]. 10.2172/1888125

Wheeling, R. (2021). Solderability of Additive Copper Surfaces [Conference Presenation]. 10.2172/1888387

Wheeling, R. (2021). High-Cycle Fatigue Test Development to Assess Solder Joints [Conference Presenation]. 10.2172/1860604

Wheeling, R. (2020). Failure Analysis Case Study: Evaluating a Low Strength Solder Joint [Conference Presenation]. 10.2172/1830997

Wheeling, R. (2020). High-Cycle Fatigue Test Development to Assess Solder Joints [Conference Poster]. https://www.osti.gov/biblio/1818047

Wheeling, R. (2020). High-cycle Fatigue (HCF) Test Development to Assess Solder Joints [Conference Poster]. https://www.osti.gov/biblio/1813923

Wheeling, R. (2020). Evaluating MetGlasTM Solderability with Tin-Silver-Copper and Tin-Silver-Bismuth Solder Alloys. 10.2172/1763529

Wheeling, R. (2020). Failure Analysis: Evaluating a Low Strength Solder Joint [Conference Poster]. https://www.osti.gov/biblio/1778874

Wheeling, R. (2019). Mechanical Behavior of Gold-containing SAC396 Solder [Conference Poster]. https://www.osti.gov/biblio/1642195

Wheeling, R., Williams, S.M., Garcia, T.C., Vianco, P.T., & Vianco, P.T. (2019). Mechanical Behavior of Gold-containing SAC396 Solder [Conference Poster]. https://www.osti.gov/biblio/1641695

Wheeling, R. (2019). Mechanical Behavior of Gold-containing SAC396 Solder [Conference Poster]. https://www.osti.gov/biblio/1641246

Wheeling, R., Williams, S.M., Vianco, P.T., & Vianco, P.T. (2019). Solderability of Additively Manufactured Copper Coatings [Conference Poster]. https://www.osti.gov/biblio/1640999

Wheeling, R., Williams, S.M., Vianco, P.T., & Vianco, P.T. (2019). Solderability of Additive Copper Surfacees [Conference Poster]. https://www.osti.gov/biblio/1640996