Arc-fault Protection in PV Installations:Ensuring PV Safety and Bankability
Abstract not provided.
Publications
Lanai grid-connected PV-battery system analysis :
Abstract not provided.
Electrical and Thermal Finite Element Modeling of Arc Faultsin Photovoltaic Bypass Diodes - Presentation
Abstract not provided.
Electrical and Thermal Finite Element Modeling of Arc Faults in Photovoltaic Bypass Diodes
Abstract not provided.
Arc-Fault Detection and Mitigation in PV Systems: Industry Progress and Future Needs
Abstract not provided.
Initial operating experience of the 12-MW La Ola photovoltaic system
The 1.2-MW La Ola photovoltaic (PV) power plant in Lanai, Hawaii, has been in operation since December 2009. The host system is a small island microgrid with peak load of 5 MW. Simulations conducted as part of the interconnection study concluded that unmitigated PV output ramps had the potential to negatively affect system frequency. Based on that study, the PV system was initially allowed to operate with output power limited to 50% of nameplate to reduce the potential for frequency instability due to PV variability. Based on the analysis of historical voltage, frequency, and power output data at 50% output level, the PV system has not significantly affected grid performance. However, it should be noted that the impact of PV variability on active and reactive power output of the nearby diesel generators was not evaluated. In summer 2011, an energy storage system was installed to counteract high ramp rates and allow the PV system to operate at rated output. The energy storage system was not fully operational at the time this report was written; therefore, analysis results do not address system performance with the battery system in place.
Creating dynamic equivalent PV circuit models with impedance spectroscopy for arc-fault modeling
Article 690.11 in the 2011 National Electrical Code{reg_sign} (NEC{reg_sign}) requires new photovoltaic (PV) systems on or penetrating a building to include a listed arc fault protection device. Currently there is little experimental or empirical research into the behavior of the arcing frequencies through PV components despite the potential for modules and other PV components to filter or attenuate arcing signatures that could render the arc detector ineffective. To model AC arcing signal propagation along PV strings, the well-studied DC diode models were found to inadequately capture the behavior of high frequency arcing signals. Instead dynamic equivalent circuit models of PV modules were required to describe the impedance for alternating currents in modules. The nonlinearities present in PV cells resulting from irradiance, temperature, frequency, and bias voltage variations make modeling these systems challenging. Linearized dynamic equivalent circuits were created for multiple PV module manufacturers and module technologies. The equivalent resistances and capacitances for the modules were determined using impedance spectroscopy with no bias voltage and no irradiance. The equivalent circuit model was employed to evaluate modules having irradiance conditions that could not be measured directly with the instrumentation. Although there was a wide range of circuit component values, the complex impedance model does not predict filtering of arc fault frequencies in PV strings for any irradiance level. Experimental results with no irradiance agree with the model and show nearly no attenuation for 1 Hz to 100 kHz input frequencies.
Top Side Cooling Via Integrated Thermal Circuits
Abstract not provided.
Overview of Arc-Faults and Detection Challenges
Abstract not provided.
Microelectronics package design using experimentally-validated modeling and simulation
Key Engineering Materials
Packaging high power radio frequency integrated circuits (RFICs) in low temperature cofired ceramic (LTCC) presents many challenges. Within the constraints of LTCC fabrication, the design must provide the usual electrical isolation and interconnections required to package the IC, with additional consideration given to RF isolation and thermal management. While iterative design and prototyping is an option for developing RFIC packaging, it would be expensive and most likely unsuccessful due to the complexity of the problem. To facilitate and optimize package design, thermal and mechanical simulations were used to understand and control the critical parameters in LTCC package design. The models were validated through comparisons to experimental results. This paper summarizes an experimentally-validated modeling approach to RFIC package design, and presents some results and key findings. © (2011) Trans Tech Publications, Switzerland.
Microelectronics package design using experimentally-validated modeling and simulation
Abstract not provided.
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