Publications

The authors improved a self-aligned emitter etchback technique that requires only a single emitter diffusion and no alignments to form self-aligned, patterned-emitter profiles. Standard commercial screen-printed gridlines mask a plasma-etchback of the emitter. A subsequent PECVD-nitride deposition provides good surface and bulk passivation and an antireflection coating. The authors used full-size multicrystalline silicon (mc-Si) cells processed in a commercial production line and performed a statistically designed multiparameter experiment to optimize the use of a hydrogenation treatment to increase performance. They obtained an improvement of almost a full percentage point in cell efficiency when the self-aligned emitter etchback was combined with an optimized 3-step PECVD-nitride surface passivation and hydrogenation treatment. They also investigated the inclusion of a plasma-etching process that results in a low-reflectance, textured surface on multicrystalline silicon cells. Preliminary results indicate reflectance can be significantly reduced without etching away the emitter diffusion.

A novel stack passivation scheme, in which plasma silicon nitride (SiN) is stacked on top of a rapid thermal SiO{sub 2} (RTO) layer, is developed to attain a surface recombination velocity (S) approaching 10 cm/s at the 1.3 {Omega}-cm p-type (100) silicon surface. Such low S is achieved by the stack even when the RTO and SiN films individually yield considerably poorer surface passivation. Critical to achieving low S by the stack is the use of a short, moderate temperature anneal (in this study 730 C for 30 seconds) after film growth and deposition. This anneal is believed to enhance the release and delivery of atomic hydrogen from the SiN film to the Si-SiO{sub 2} interface, thereby reducing the density of interface traps at the surface. Compatibility with this post-deposition anneal makes the stack passivation scheme attractive for cost-effective solar cell production since a similar anneal is required to fire screen-printed contacts. Application of the stack to passivated rear screen-printed solar cells has resulted in V{sub oc}`s of 641 mV and 633 mV on 0.65 {Omega}-cm and 1.3 {Omega}-cm FZ Si substrates, respectively. These V{sub oc} values are roughly 20 mV higher than for cells with untreated, highly recombinative back surfaces. The stack passivation has also been used to form fully screen-printed bifacial solar cells which exhibit rear-illuminated efficiency as high as 11.6% with a single layer AR coating.

The Photovoltaic Manufacturing Technology Project (PVMaT) is a government/industry research and development (R and D) partnership between the US federal government (through the US Department of Energy [DOE]) and members of the US PV industry. The goals of PVMaT are to help the US PV industry improve module manufacturing processes and equipment; accelerate manufacturing cost reductions for PV modules, balance-of-systems components, and integrated systems; increase commercial product performance and reliability; and enhance the investment opportunities for substantial scale-ups of US-based PV manufacturing plant capacities. The approach for PVMaT has been to cost-share risk taking by industry as it explores new manufacturing options and ideas for improved PV modules and other components, advances system and product integration, and develops new system designs, all of which will lead to overall reduced system life-cycle costs for reliable PV end products. The PVMaT Phase 4A module manufacturing R and D projects are just being completed and initial results for the work directed primarily to module manufacture are reported in this paper. Fourteen new Phase 5A subcontracts have also just been awarded and planned R and D areas for the ten focused on module manufacture are described. Finally, government funding, subcontractor cost sharing, and a comparison of the relative efforts by PV technology throughout the PVMaT project are presented.

The authors improved a self-aligned emitter etchback technique that requires only a single emitter diffusion and no alignment to form self-aligned, patterned-emitter profiles. Standard commercial screen-printed gridlines mask a plasma-etchback of the emitter. A subsequent PECVD-nitride deposition provides good surface and bulk passivation and an antireflection coating. They used full-size multicrystalline silicon (mc-Si) cells processed in a commercial production line and performed a statistically designed multiparameter experiment to optimize the use of a hydrogenation treatment to increase performance. They obtained an improvement of almost a full percentage point in cell efficiency when the self-aligned emitter etchback was combined with an optimized 3-step PECVD-nitride surface passivation and hydrogenation treatment. They also investigated the inclusion of a plasma-etching process that results in a low-reflectance, textured surface on multicrystalline silicon cells. Preliminary results indicate reflectance can be significantly reduced without etching away the emitter diffusion.

We developed a self-aligned emitter etchback technique that requires only a single emitter diffusion and no alignments to form self-aligned, patterned-emitter profiles. Standard, commercial, screen-printed gridlines mask a plasma-etchback of the emitter. A subsequent PECVD-nitride deposition provides good surface and bulk passivation and an antireflection coating. We succeeded in finding a set of parameters which resulted in good emitter uniformity and improved cell performance. We used full-size multicrystalline silicon (mc-Si) cells processed in a commercial production line and performed a statistically designed, multiparameter experiment to optimize the use of a hydrogenation treatment to increase performance. Our initial results found a statistically significant improvement of half an absolute percentage point in cell efficiency when the self-aligned emitter etchback was combined with a 3-step PECVD-nitride surface passivation and hydrogenation treatment.

A technique is presented to simultaneously diffuse boron and phosphorus in silicon, and grow an in-situ passivating oxide in a single furnace step. It is shown that limited solid doping sources made from P and B Spin-On Dopant (SOD) films can produce optimal n{sup +} and p{sup +} profiles simultaneously without the deleterious effects of cross doping. A high quality passivating oxide is grown in-situ beneath the thin ({approximately} 60 {angstrom}) diffusion glass, resulting in low J{sub o} values below 100 fA/cm{sup 2} for transparent ({approximately} 100 {Omega}/{open_square}) phosphorus and boron diffusions. For the first time it is shown that impurities present in the boron SOD film can be effectively filtered out by employing separate source wafers, resulting in bulk lifetimes in excess of 1 ms for the sample wafers. The degree of lifetime degradation in the sources is related to the gettering efficiency of boron in silicon. This novel simultaneous diffusion, in-situ oxidation, impurity filtering and gettering technique was successfully used to produce 20.3% Fz, and 19.1% Cz solar cells, in one furnace step.

We studied whether plasma-etching techniques can use standard screen-printed gridlines as etch masks to form self-aligned, patterned-emitter profiles on multicrystalline-silicon (mc-Si) cells from Solarex. We conducted an investigation of plasma deposition and etching processes on full-size mc-Si cells processed in commercial production lines, so that any improvements obtained would be immediately relevant to the PV industry. This investigation determined that reactive ion etching (RIE) is compatible with using standard, commercial, screen-printed gridlines as etch masks to form self-aligned, selectively doped emitter profiles. This process results in reduced gridline contact resistance when followed by plasma-enhanced chemical vapor deposition (PECVD) treatments, an undamaged emitter surface easily passivated by plasma-nitride, and a less heavily doped emitter between gridlines for reduced emitter recombination. This allows for heavier doping beneath the gridlines for even lower contact resistance, reduced contact recombination, and better bulk defect gettering. Our initial results found a statistically significant improvement of about half an absolute percentage point in cell efficiency when the self-aligned emitter etchback was combined with a PECVD-nitride surface passivation treatment. Some additional improvement in bulk diffusion length was observed when a hydrogen passivation treatment was used in the process. We attempted to gain additional benefits from using an extra-heavy phosphorus emitter diffusion before the gridlines were deposited. However, this required a higher plasma-etch power to etch back the deeper diffusion and keep the etch time reasonably short. The higher power etch may have damaged the surface and the gridlines so that improvement due to surface passivation and reduced gridline contact resistance was inhibited.

Silicon solar cell efficiencies of 17.1%, 16.4%, 14.8%, and 14.9% have been achieved on FZ, Cz, multicrystalline (mc-Si), and dendritic web (DW) silicon, respectively, using simplified, cost-effective rapid thermal processing (RTP). These represent the highest reported efficiencies for solar cells processed with simultaneous front and back diffusion with no conventional high-temperature furnace steps. Appropriate diffusion temperature coupled with the added in-situ anneal resulted in suitable minority-carrier lifetime and diffusion profiles for high-efficiency cells. The cooling rate associated with the in-situ anneal can improve the lifetime and lower the reverse saturation current density (Jo), however, this effect is material and base resistivity specific. PECVD antireflection (AR) coatings provided low reflectance and efficient front surface and bulk defect passivation. Conventional cells fabricated on FZ silicon by furnace diffusions and oxidations gave an efficiency of 18.8% due to greater short wavelength response and lower Jo.

We have investigated whether an in-situ hydrogen or ammonia rf-plasma treatment prior to a PECVD-nitride deposition would promote bulk defect passivation independently of surface effects. We also studied whether the predeposition of a thin silicon-nitride protective layer vbefore performing the plasma treatment would serve to minimize surface damage. We found that for the limited set of deposition conditions in of cells processed using the used five different deposition strategies and compared the resulting cell performance with that investigated so far, the direct deposition of PECVD-nitride produces the best cells on String Ribbon silicon wafers to date, with efficiencies up to 14.5%. Hydrogen and ammonia plasma pretreatments without a protective nitride layer resulted in better bulk passivation, but damaged surfaces. Pretreatments after deposition of the protective layer produced the best surface passivation, but were not effective in passivating the bulk.

This is a second annual report since the University Center of Excellence for Photovoltaics Research and Education was established at Georgia Tech. The major focus of the center is crystalline silicon, and the mission of the Center is to improve the fundamental understanding of the science and technology of advanced photovoltaic devices and materials, to fabricate high-efficiency cells, and develop low-cost processes, to provide training and enrich the equational experience of students in this field, and to increase US competitiveness by providing guidelines to industry and DOE to achieve cost-effective and high-efficiency photovoltaic devices. This report outlines the work of the Center from July 1993--June 1994.

The Photovoltaic Manufacturing Technology (PVMaT) Project was initiated in 1990 to help the US photovoltaic (PV) industry extend its world leadership role in manufacturing and commercially developing PV modules and systems. It is being conducted in several phases, staggered to support industry progress. The four most recently awarded subcontracts (Phase 2B) are now completing their first year of research. They include two subcontracts on CdTe, one on Spheral Solar[trademark] Cells, and one on cast polysilicon. These subcontracts represent new technology additions to the PVMaT Project. Subcontracts initiated in earlier phases are nearing completion, and their progress is summarized. An additional phase of PVMaT, Phase 4A, is being initiated which will emphasize product-driven manufacturing research and development. The intention of Phase 4A is to emphasize improvement and cost reduction in the manufacture of full-system PV products. The work areas may include, but are not limited to, issues such as improvement of module manufacturing processes; system and system component packaging, integration, manufacturing, and assembly; product manufacturing flexibility; and balance-of-system development with the goal of product manufacturing improvements.

A limited pilot production run on PESC silicon solar cells for use at high concentrations (200 to 400 suns) is summarized. The front contact design of the cells was modified for operation without prismatic covers. The original objective of the contract was to systematically complete a process consolidation phase, in which all the, process improvements developed during the contract would be combined in a pilot production run. This pilot run was going to provide, a basis for estimating cell costs when produced at high throughput. Because of DOE funding limitations, the Photovoltaic Concentrator Initiative is on hold, and Applied Solar`s contract was operated at a low level of effort for most of 1993. The results obtained from the reduced scope pilot run showed the effects of discontinuous process optimization and characterization. However, the run provided valuable insight into the technical areas that can be optimized to achieve the original goals of the contract.

This document serves as the proceedings for the annual project review meeting held by Sandia's Photovoltaic Cell Research Division and Photovoltaic Technology Division. It contains information supplied by each organization making a presentation at the meeting, which was held August 7 through 9, 1990 at the Sheraton Hotel in Albuquerque, New Mexico. Sessions were held to discuss national photovoltaic programs, one-sun crystalline silicon cell research, concentrator silicon cell research, concentrator 3-5 cell research, and concentrating collector development.