Publications

Abstract not provided.

To address lithium-ion cell safety issues in demanding power applications, electrical and thermal abuse tests were performed on 18650 sized cells. Video and electrically monitored abuse tests in air included short circuit, forced overcharge, forced reversal, and controlled overheating (thermal) modes. Controlled overheating tests to 200 C were performed in a sealed chamber under a helium atmosphere and the gases released from the cell during thermal runaway were analyzed at regular intervals using gas chromatography and mass spectrometry. In addition to alkane and alkene solvent breakdown fragments, significant H{sub 2} was detected and evidence that HF was evolved was also found.

An automated gas chromatography was used to analyze water samples contaminated with trace (parts-per-billion) concentrations of organic analytes. A custom interface introduced the liquid sample to the chromatography. This was followed by rapid chromatographic analysis. Characteristics of the analysis include response times less than one minute and automated data processing. Analytes were chosen based on their known presence in the recycle water streams of semiconductor manufacturers and their potential to reduce process yield. These include acetone, isopropanol, butyl acetate, ethyl benzene, p-xylene, methyl ethyl ketone and 2-ethoxy ethyl acetate. Detection limits below 20 ppb were demonstrated for all analytes and quantitative analysis with limited speciation was shown for multianalyte mixtures. Results are discussed with respect to the potential for on-line liquid process monitoring by this method.

Silicon wafers are coated with photoresist and exposed to ultraviolet (UV) light in a laboratory to simulate typical conditions expected in an actual semiconductor manufacturing process tool. Air is drawn through the exposure chamber and analyzed using chemical ionization mass spectrometry (CI/MS). Species that evaporate or outgas from the wafer are thus detected. The purpose of such analyses is to determine the potential of CI/MS as a real-time process monitoring tool. Results demonstrate that CI/MS can remotely detect the products evolved before, during, and after wafer UV exposure; and that the quantity and type of products vary with the photoresist coated on the wafer. Such monitoring could provide semiconductor manufacturers benefits in quality control and process analysis. Tool and photoresist manufacturers could also realize benefits from this measurement technique with respect to new tool, method, or photoresist development. The benefits realized can lead to improved device yields and reduced product and development costs.

No abstract available.

No abstract available.