Cured Properties G vs TempMaster CurveCTE vs TempK vs TempCp vs TempComp Yield at TempsTensile Yield at 23CTensile Creep – Slow CoolTensile Creep – Fast CoolCohesive FailureAdhesive Failure Curing Properties Pre-ReactionGelation ReactionViscosityCure ShrinkageG During CureTg During CureCohesive Failure During Cure Composition 100 pbw diglycidyl ether of bisphenol A (Epon 828)12 pbw diethanolaminecured 24 hours at 71C