Measured with a TA Instruments Q800 DMA.
DOWNLOAD DATA FILES
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- 828/DEA: Shear Modulus vs Temp
- 828/DEA: Master Curve
- 828/DEA: Linear CTE vs Temp
- 828/DEA: Bulk Modulus vs Temp
- 828/DEA: Heat Capacity vs Temp
- 828/DEA: Compressive Yield
- 828/DEA: Tensile Yield
- 828/DEA: Tensile Creep for Fast Cooling Rate
- 828/DEA: Tensile Creep for Slow Cooling Rate
- 828/DEA: Cohesive Failure
- 828/DEA: Adhesive Failure
- 828/DEA: Pre-Reaction Kinetics
- 828/DEA: Gelation Reaction Kinetics
- 828/DEA: Viscosity Increase During Cure
- 828/DEA: Cure Shrinkage
- 828/DEA: Tg During Cure
- 828/DEA: Cohesive Strength During Cure
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- 828/D230: Shear Modulus vs Temp
- 828/D230: Master Curve
- 828/D230: Linear CTE vs Temp
- 828/D230: Yield
- 828/D230: Tensile Creep at 23C
- 828/D230: Gelation Reaction Kinetics
- 828/D230: Viscosity Increase During Cure
- 828/D230: Shear Modulus During Cure
- 828/D230: Tg During Cure
- 828/D230: Cure Shrinkage
- Curative: Weight Loss
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- Sylgard 184: Shear Modulus vs Temp
- Sylgard with Silica: Linear CTE vs. vol% Filler
- Sylgard 184: Young’s Modulus at 23C
- Sylgard 184: Bulk Modulus at 22C
- Sylgard 184: Adhesion Tests at 23C
- Sylgard 184: Gelation Reaction Kinetics
- Sylgard 184: Kinetics with 5% 3-6559 Accelerator
- Sylgard 184: Viscosity with 5% 3-6559 Accelerator
- Sylgard 184: Viscosity Increase During Cure
- Sylgard 184: Viscosity with 5% 3-6559 Accelerator
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