Hysol KE4238 / HD3475 Conductive Epoxy: Silver Volume Fraction and Adhesive Failure

silver volumetric loading from thermogravimetric (TGA tests):
70 wt% of material left at 850C gives 20 vol% silver loading
based on filler density = 10.5 g/cc

stress at failure from stainless steel napkin ring at 23C = 36.7 ± 9.0 MPa