CS3100 Polysulfide with Phenolic Microballoons

Cured Properties

• G’ vs Temp
• CTE vs Temp
• Young’s Modulus at 23C
• Bulk Modulus at 23C
• Adhesive Failure at 23C

Composition:

• 100 pbw CS3100 base resin from Flamemaster
• 9.7 pbw CS3100 curing agent from Flamemaster
• 3 pbw heat treated phenolic microballoons (Asia Pacific Microspheres)
• 9 hours at 71C