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  LTCC multi-chip module

A high density LTCC multi-chip module

Electronic Packaging

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The Electronic Packaging technologies in the Thin Film, Vacuum, & Packaging Department are a resource for all aspects of microelectronic packaging. From design and layout to fabrication of prototype samples, the staff offers partners the opportunity for concurrent engineering and development of a variety of electronic packaging concepts. This includes assistance in selecting the most appropriate technology for manufacturing, analysis of performance characteristics and development of new and unique processes.


  1. Network Fabrication
    • Low Temperature Co-Fired Ceramic (LTCC)
    • Thick Film
    • Thin Film
  2. Packaging and Assembly
    • Chip Level Packaging
    • MEMs Packaging
    • Hermetic Sealing
    • Surface Mount Technology
  3. Integrated Passive Components
    • Resistors
    • Capacitors
    • Inductors
  4. Laser Processing
    • Machining Ceramic
    • Resistor Trimming
    • Serialization

Network Fabrication

Network fabrication is accomplished by patterning metals and dielectrics onto a free-standing substrate to form the base of a microcircuit. A variety of substrates, processes, and metals are used to do this. Several options are available for producing networks depending on requirements for circuit size, heat produced, operating frequency, cost and other factors.

Packaging and Assembly

  Thick film MCM

A thick film MCM for high temperature use

This department has the capabilities to fabricate a variety of integrated chip (IC) carrier assemblies, hybrid microcircuits, multi-chip modules and other unique electronic assemblies. The focus in packaging and assembly is two-fold: 1) development of advanced concepts in packaging and assembly and 2) providing technology and production oversight to Sandia organizations.

Integrated Passive Components

This technology focuses on the use of silicon chip passive components and screen printing to fabricate small RCL type networks required to achieve miniaturization of electronic systems. Compared to discrete surface mount type components this packaging approach will allow up to 4X reduction in network size. This department's engineering resources and manufacturing capabilities promote design and rapid prototyping of these passive component assemblies in a concurrent engineering environment.

Laser Processing

Using CO2 and ND-YAG lasers this department has developed capabilities for machining complex geometries, hole drilling and scribing both fired and "green" alumina and other materials. The use of a PC controlled ND-YAG laser system, incorporating a "flying probe" system, enhances our laser processing capabilities to include passive and active trimming of thick and thin film resistors to 1% as trimmed tolerance. In addition the ND-YAG laser system has been extensively used for alpha-numeric serialization of a wide variety of components types ranging from Neutron Tube ceramic piece parts to high carbon steel tool tips.



Ken Peterson