Feature Length-Scale Modeling of LPCVD and PECVD MEMS Fabrication Processes
L. C. Musson, P. Ho, S. J. Plimpton, R. C. Schmidt, Journal of Microsystems Technologies, 12, 137-142 (2005).
The surface micromachining processes used to manufacture MEMS devices and integrated circuits transpire at such small length scales and are sufficiently complex that a theoretical analysis of them is particularly inviting. Under development at Sandia National Laboratories (SNL) is Chemically Induced Surface Evolution with Level Sets (ChISELS), a level-set based feature-scale modeler of such processes. The theoretical models used, a description of the software and some example results are presented here. The focus to date has been of low-pressure and plasma enhanced chemical vapor deposition (low-pressure chemical vapor deposition, LPCVD and PECVD) processes. Both are employed in SNLs SUMMiT V technology. Examples of step coverage Of SiO2 into a trench by each of the LPCVD and PECVD process are presented.
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