We have the ability to prototype, and to provide quick turn plastic and ceramic packaging and assembly for trusted applications. Working closely with the Failure Analysis group, we also qualify products and test products to evaluate performance and reliability.
Our capabilities range from die singulation to microsystems integration:
Dicing
- Die singulation
- MEMS dicing
- Dicing of
- Si, glass, quartz, and various ceramics (alumina, LTCC, AlN, etc.) and organics
- Up to 200 mm wafers
- Thinned wafers
- Multi-project wafers
Die Sorting and Inspection
- Die and wafer tracking
- Laser marking
- Optical Inspection
Die Attach
- Manual and automated, precision die placement
- Various organic (epoxy) die attach materials
- Eutectic die attach
Wire Bonding
- Manual and automated wire bonding
- Wedge and ball bonding
- Fine pitch (down to 50 um)
- High wire count
- Wire bonding to ceramic, organic, metal packages
Seal and Encapsulation
- Hermetic ceramic packaging
- Solder lid seal
- Parallel seam sealing
Flipchip Assembly
- Eutectic and high Pb solders
- Au stud bumping (wafer or die)
- Plastic and ceramic substrates
- Precision underfill dispensing
Packaging and Assembly Design/Development
- Package design and selection (ceramic and plastic substrates)
- Materials selection and evaluation
- Packaging and assembly process development
- Full custom microsystems integration
Custom Packaging and Assembly
- Multi-chip modules
- Thermo-compression bonding
- Die-to-die, wafer-to-wafer, and die-to-wafer.
- MEMs packaging and assembly
- RF assembly
- Optoelectronic assembly
- Flex circuit assembly
- Surface Mount assembly
- Plastic qualified packaging (PQFP & PBGA)
- Rework and repackaging
Thermal Management
- Thermal Simulation and modeling
- Thermal imaging
Test Performance and Reliability
- HAST (highly accelerated stress testing)
- HALT (highly accelerated lifetime testing)
- Long-term dormant storage
- Temperature cycling
- Nondestructive testing
- CSAM (C-mode scanning acoustic microscopy)
- Real-time x-ray imaging
For additional information or questions, please email us at Packaging and Assembly |
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