Special Features
- Metal-via configurable, fabric-like structure using ViASIC® Via-Mask Technology
- Partitioned Vdd's for power sequencing and redundancy
- “Off-Grid” unused transistors to minimize power consumption, static current and photocurrent
- On-package decoupling capacitors
Benefits
- Structured ASIC enables rapid turn-around, lowers Non-Recurring Engineering (NRE) and development costs
- Pre-qualified base arrays reduces development risk
- Open architecture minimizes Diminishing Manufacturing Sources (DMS) issues
- Regular, fabric-like structure enhances verifiability of trusted parts
Applications
- Command and Control
- Safety, Security, and user defined Trusted Hardware
- Obsolete parts and FPGA emulation
- Rad-hard environment operation
- High-reliability systems
- 380Kb configurable distributed Dual-Port RAM
- 368Kb configurable ROM
- 239 configurable I/Os, PCI compatible
- 8 pairs LVDS I/Os
- Dual Oscillators
- Power Monitor Circuit
- Phase Lock Loop
- 4 Power partitions
- Unused ckts totally isolated
- Package options
- 400 pin plastic LGA
- Ceramic version of 400 LGA in development
- 391 pin ceramic PGA
- Other
- 3.3v, 0.35um, CMOS-SOI
For additional information or questions, please email us at ASIC Custom Solutions.
