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Packaging

Packaging and assembly involves interconnecting ICs and/or other components to a plastic or ceramic substrate, and subsequently integrating that package into a system.  Over the span of four decades, the Advanced Microsystems Packaging Department has developed core competencies in microsystems packaging and assembly.  Strategic partnerships within Sandia, and with national laboratories, universities, commercial packaging houses, and private industry enable the development and implementation advanced microsystems packaging solutions with the greatest value to our customers.

Packaging Technologies:

For additional information or questions, please email us at Packaging and Assembly


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