MSTC - Microsystems Science, Technology, and Components

Packaging and assembly involves interconnecting ICs and/or other components to a plastic or ceramic substrate, and subsequently integrating that package into a system. Over the span of four decades, the Advanced Microsystems Packaging Department has developed core competencies in microsystems packaging and assembly. Strategic partnerships within Sandia, and with national laboratories, universities, commercial packaging houses, and private industry enable the development and implementation advanced microsystems packaging solutions with the greatest value to our customers.

Packaging Technologies:

ISO 9001 registered high-reliability ASIC packaging
Hermetic ceramic and plastic qualified packaging (PQFP & PBGA)
RF and optoelectronics packaging
MEMS packaging
Flex and surface mount assembly
Rapid hybrid microsystems prototyping
Ultra-miniaturization (3-D packaging and 3-D Integration)

For additional information or questions, please email us at Packaging and Assembly

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