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General Info

Microsystems R&D SERVICES

cleanroom

COTS

Failure Analysis & Reliability Physics Equipment

III-V epitaxial growth

Mems ASIC

Optoelectronics and Photonics

 

ASIC Design & Test

Components & Commercial Off-The-Shelf (COTS) Components Qualification

  • Counterfeit Analysis
  • High Reliability
  • Mil Spec
  • Qualification
  • Trusted COTS

Failure Analysis & Reliability Physics

  • Electron Beam
  • FIB
  • Light Beam
  • Light Emission Imaging
  • Optical Beam
  • SEM
  • Visual and NIR

Metal Micromachining Program

MEMS Design & Test

Modeling & Simulation

Optoelectronics & Photonics

  • Biophotonics
  • Optical Device Characterization
  • Optoelectronic design
  • Optical network design

Packaging

  • Flex and surface mount assembly
  • Hermetic ceramic and plastic qualified packaging (PQFP & PBGA)
  • ISO 9001 registered high-reliability ASIC packaging
  • MEMS packaging
  • Rapid hybrid microsystems prototyping
  • RF and optoelectronics packaging
  • Ultra-miniaturization (3-D packaging and 3-D Integration)

Rad-Hard Hard Assurance & Assessments

  • Design and Layout
  • Nano Technology
  • Optical Technology
  • Radiation-Hardened ASICS
  • System Modeling
  • Testing and Assurance
  • VHDL and Verilog

Semiconductor Fabrication


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