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FACILITIES

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MESAFab Fabrication Facilities

The MESAFab provides high-mix low-volume production of custom integrated microsystem products.  It also supports state-of-the-art microfabrication capability for scientific and engineering research, technology advancement and maturation, and small-lot, fast-turn prototyping.  We develop and maintain core semiconductor processing capabilities and capacity that enable our customers to build differentiating microsystems products. Two unique facilities are co-located within the 65,000 square foot MESAFab facility including:  (1) a 11,900 square foot Class 1 cleanroom in the SiFab for silicon wafer processing (currently 150-mm diameter wafers) and (2) 14,900 square foot Class 10 and Class 100 cleanroom in the MicroFab for III-V compound semiconductor material processing and silicon wafer post-processing. 

The SiFab has processing expertise in both CMOS and MEMS technologies.   The focus of the SiFab is the development, application and production of radiation-hardened CMOS integrated circuit technologies capable of realizing digital, analog, mixed-mode, and nonvolatile memory circuits.  In addition, the silicon wafer fab supports development and production of Sandia’s SUMMiT™ surface micromachining technology.  We are capable of producing full-flow production lots with quick turnaround time as well as performing flexible process development.  We also offer unique prototyping capabilities. Over 150 equipment sets are maintained, supported and operated 24 hours per day, 5 days a week (3 shifts).  Both processing and maintenance expertise are staffed on all 3 shifts.

The MicroFab is a green-certified facility for III-V compound semiconductor material processing, post silicon wafer processing and advanced packaging. The 150-mm silicon post-processing facility also supports glass and plastics processing, hybrid substrates and 3D integration.  The MicroFab is designed for flexibility to allow development of a range of III-V compound semiconductor based optoelectronic, RF, photonic and sensor microsystem technologies. Reconfigurable tools, many with little or no hardware changes required, allow for the processing of wafer pieces and full wafers up to 6 inch. All of the MicroFab equipment (180 tools) are maintained and supported by our in-house maintenance and technical staff.  We prototype design and process alternatives and perform highly customized, low-volume production with our flexible processing capabilities.

The MESAFab key fabrication capabilities include:

  • 3D Integration
  • Chemical Mechanical Polishing (CMP) for planarization
  • Deep Reactive Ion Etch (DRIE)
  • Electron Beam (E-Beam) Lithography
  • Electroplating
  • Failure Analysis
  • III-V Compound Semiconductor Epitaxial Growth
  • Ion Implantation
  • Materials Characterization
  • MEMS Release
  • Metrology
  • Mixed-Technology Integration and Processing
  • Oxidation and Diffusion
  • Packaging
  • Photolithography Processes (Coat/Expose/Develop)
  • Reactive Ion Etch
  • Statistical Process Control
  • Thin Films
  • Wafer Bonding and Thinning
  • Wet Etch/Clean
  • Yield Learning

Design, Test and Analytical Laboratories

Our facilities also include 108 dedicated laboratories for design, test and analytical support. These labs support the research and development critical to the production of microsystems components as well as for rapid prototyping and testing of those components. Capabilities include design, microsystem integration, failure analysis and reliability physics, modeling and simulation, component engineering, test and packaging.


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