Microsystems Reliability Physics Program
- SUMMiTTM (Sandia Ultra-Plannar, Multi-Level MEMS Technology)
Technology
- Parametric test & infrastructure development
- Design for reliability
- Process monitoring
- MEMS Reliability Research
- Interface reliability – stiction, friction, wear
- Science of aging in package environment
- In-situ metals mechanical properties measurement
- Surface Micromachine (SMM) In-situ functional test development
MEMS Parametic
Test
Characterize Surface and Bulk Properties
Wafer-Level Stress Characterization
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Please address comments or questions to Paul
Dodd, Jim Schwank, Marty
Shaneyfelt,
or Jim Felix.
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