Microsystems Science & Technology Center

Integrated Photonics Institute for Manufacturing Innovation (IP-IMI)

  • Microsystems Science & Engineering Applications (MESA) Complex: A 400,000 Sq-Ft Development & Production Facility

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  • Microsystems Science, Technology & Components

    IP-IMI
  • IP-IMI Heterogeneous Integration

    IP-IMI

Sandia is positioned to engage in partnerships in silicon and compound semiconductor photonic device or system research, development and prototyping. Sandia’s broad technology base combined with vertical integration from crystal growth to prototype development enables leveraging of design and fabrication expertise mated to technology/capability gaps. Interactions leveraging Sandia’s technical expertise in a collaborative fashion make best use of the capability and enhance success.

Two FFRDCs, DoD’s Lincoln Laboratory (MA) and DOE’s Sandia National Laboratory (NM), are known to possess unique capability in the area of integrated photonics. Both of these labs and their sponsors are interested in supporting an Integrated Photonics Institute. DoD and DOE have agreed to allow these two labs to participate in the Integrated Photonics Institute after an award is made. Therefore, for planning purposes, offerors should not expect to include these two FFRDCs in their proposal, but should take into account their availability – as needed by the consortium – in a post-award scenario. Details of their involvement as an Institute member will be the responsibility of the awardee in consultation with the government after a selection has been made.

Areas of Expertise

Rad-Hard Electronics & Trusted Systems

Capabilities Overview

The multi-mission environment of the Labs promotes a diverse, multi-disciplinary team of subject matter experts in fabrication labs and clean room facilities. Two important Sandia support labs - the Silicon Photonic Foundry and the III-V Photonic Integrated Circuit (PIC) Lab - are co-located inside the MESA facility.

Fabrication Capabilities

Compound III-V Photonics

The InGaAsP/InP PIC program at Sandia National Labs resides within the MESA facility and is presently used for customer-specific photonic R&D, such as optical data sampling and RF-analog signal processing in the optical domain. Demonstrated capability exists to 40 Gb/s.

Photonics

Silicon Photonics

The silicon photonics process is an electro-optical silicon photonic integrated circuit platform built on silicon on insulator (SOI) wafer technology with fully integrated Ge detectors.

Quantum Systems

Heterogeneous Integration

Sandia has unique capabilities in hybrid integration of custom photonic devices and advanced electronic circuits, enabling prototyping of high-performance optoelectronic systems and microsensors.

Quantum Systems

Advanced Packaging

Sandia experts have decades of experience with the microsystems packaging process, a key step in successful development of integrated systems.

Sensors

Applications

Sandia’s mission in national security has fostered capabilities and technologies including Photonics, Photovoltaics, Focal Plane Arrays, Advanced Sensors, Optical MEMS, Plasmonics, and Metamaterials.

MEMS

Biological Microsensors

Sandia's Microsystems effort develops sensors and sensor arrays for biological detection.

MEMS

Failure Analysis, Test, and Reliability Support

Sandia experts invent, develop and utilize different tools and techniques for root cause failure analysis. Sandia supports its customers throughout the product life cycle.

Fabrication Capabilities

Trust, Classified, ITAR

A fully trusted accreditation status and limited access control process may both be utilized for national security projects via the MESA facility.