Vacuum Processes
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The vacuum processing capabilities in our Thin Film, Vacuum, & Packaging Laboratory encompass several areas. Capabilities include vacuum, inert gas and hydrogen firing; thermal desorption mass spectroscopy; vacuum outgassing rate measurement; ion beam milling; and cermet densification.
Capabilities:
- Expertise in the development of cleaning processes and materials characterization of vacuum materials and components
- Vacuum and hydrogen firing of components for oxide reduction and cleaning of vacuum components
- Large scale cleaning processes, vapor degreasing and vacuum firing for large volume components
- Thermal desorption mass spectroscopy of material and components with controlled temperature ramp rates to 1500°C in a UHV environment
- Vacuum outgassing rate measurements and mass spectroscopy of materials and components
- Controlled dosing of materials with known gases
- Densification of cermet materials in hydrogen gas environment and elevated temperatures
Resources:
- Vacuum outgassing measurement system
- Thermal desorption mass spectrometry system
- Multi-size vacuum, hydrogen, and inert gas processing furnaces producing 2000°C with hot zones up to 16 ft3
- Solvent vapor degreasing systems
- High temperature (205°C) controlled atmosphere furnace to densify cermets
- Kaufman ion sources for broad beam ion milling of surfaces up to 3" diameter
Accomplishments:
- Measured inter-diffusion rates of thin film metals on metal substrates
- Measured the vacuum outgassing rate of stepper motors to be used in the National Ignition Facility laser fusion device.
Contacts:
Ron Goeke
Chuck Walker
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