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Technologies

Plating and Lithography

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  450 ft2 Plating Laboratory

450 h2 Plating Laboratory

The Plating capabilities in the Thin Film, Vacuum and Packaging department includes both electroless and electro plating. These processes support Multi-Chip Module, microelectromechanical systems (MEMS), Weapons Systems (Neutron Tubes) and other miscellaneous projects.

Capabilities:

Resources:

  Polymer Extrusion Coater

Polymer Extrusion Coater

Accomplishments:

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Lithography

Photo-processing facilities are available in the Thin Film, Vacuum, & Packaging Technologies department to provide patterning and circuitry on a variety of substrate materials. The department's capabilities include dry film, liquid, and electrophoretically deposited resist application, exposure, development and patterning.

Capabilities:

Resources:

Accomplishments:

Contacts:
Robert Stokes
Ken Peterson