Materials Characterization
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MS&T provides a broad range of techniques to characterize organic materials. These techniques assist you in understanding and improving the materials and processes used (e.g., encapsulation, adhesion, composites).
Capabilities:
- Thermal Analysis - Determine glass transition temperature (Tg), heat capacity (Cp), heat of cure, curing reaction kinetics, glassy and rubbery modulus, coefficient of thermal expansion, volatile and organic content, and decomposition temperatures
- Rheological Testing - Characterize the rheological properties of liquids, melts and solids
- Work of Adhesion - Measure work of adhesion between polymeric materials (JKR)
- High Resolution Video Imaging System - Measure both static and kinetic data over large and small areas; flow visualization
- Qualification of Alternative Materials and Processes - Identify and qualify alternative materials to replace toxic and/or carcinogenic materials, addressing both long and short term compatibility issues
- Electron (SEM) and Optical Microscopy -
A full range of macro to 2000X optical imaging; SEM capabilities: up to 60kx imaging SE and BSE detection, and ESEM low vacuum (charge dissipation, etc.) options. EDS x-ray analysis for spectrum collection (element identification), line mapping, and area mapping. Complete sample preparation including low/high speed saws, potting, polishing, and etching.
- Interfacial Properties Analysis - Static and Dynamic Contact Angle, Surface Tension
- Dielectric Measurements- Dielectric measurements for cure kinetics, flow properties, etc.
Resources:
- Thermal Analysis (DSC, TMA, TGA, DMA)
- Rheological Testing
- Work of Adhesion - JKR
- Optical Imaging
- Scanning Electron Microscopy (ESEM)
- Elemental Analysis (EDS)
- Dynamic and static contact angle measurements
- Dielectric measurement apparatus
Accomplishments:
- Developed a method to measure work of adhesion.
- Developed method to determine the cure profiles of elastomers based on their changing dielectric properties.
- Developed a set of metrology tools to characterize flow of encapsulants for underfilling flip-chip packages.
Contacts:
Mike Kelly
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