skip to: onlinetools | mainnavigation | content | footer

MST Home

 

Technologies

  cq523_150.GIF (12759 bytes)

Study of inclusion effect on encapsulation stress

Encapsulation

Many of the components we work with are encapsulated in either highly filled epoxies or in foams of varying density.  Encapsulation is performed for a variety of reasons, including high voltage standoff, shock and vibration isolation, stress relief, environmental isolation, etc.

We not only perform encapsulation, but we conduct research into the component-encapsulation adhesive bond, fracture of the adhesive bond, the stress developed during cure, cure kinetics of the encapsulant material, and the effect of inclusions on the bulk stress field.  We have worked to develop more environmentally friendly substitutes for the traditional epoxies and foams.  We can help you choose an encapsulant material, develop a cure schedule that minimizes stress on the components, test the encapsulant, and actually perform the encapsulation.

Capabilities:

  cq172_150.GIF (12013 bytes)

"Groove" tool used for meteorology of underfill encapsulant properties

Resources:

  cq93_150.GIF (17247 bytes)

Flow visualization of underfill encapsulant through a BGA

Accomplishments:

  cq414_150.GIF (11047 bytes)

Dielectric tool for measuring underfill encapsulant properties

Contacts:
John A. Emerson
Mike Kelly