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  Rachel Giunta uses Finetech flip-chip aligner

Finetech flip-chip aligner used to adhesively bond parts requiring alignment to ± 5 microns

Adhesive Bonding

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Understanding and controlling the factors that affect adhesion is vital for ensuring consistent successful bonding operations. The Manufacturing Science and Technology Center's research into adhesion is focused on achieving a good initial bond and then understanding the mechanisms leading to eventual bond failure. The department is working to understand crack propagation at the interface and has developed a variety of mechanical testing techniques to evaluate this failure mode. The factors affecting wetting and formation of the bond (e.g., contamination, surface roughness) are being explored to further our knowledge.

In addition to research into adhesion, we bond and join components for our customers. Researchers have formulated new materials that reduce or eliminate the Environmental, Safety and Health (ES&H) hazards associated with various polymer processes. The Center can help develop new bonding materials and processes, analyze existing bonds, and understand failed bonds.

Capabilities:

  underfill process for attaching a thick film resistor on the MC4300 neutron tube

Underfill process for attaching thick film resistor on the MC4300 Neutron Tube

Resources:

  Dave Zamora performs the underfill process for attaching a thick film resistor

Dave Zamora performs underfill process on MC4300 Neutron Tube

Accomplishments:

Contacts:
Dave Zamora