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Research Briefs

• Model Mixed Metal Oxide Catalysts for Partial Oxidation of Hydrocarbons
• Automotive Lean-Burn NOx Catalysis
• Directed-Assembly using Steep Gradients
• HSMix: Simulations of Hard Particle Systems
• Oxidative Dehyrogenation of Ethane to Ethylene
• ESP (Engineered Stress Profile) Glass - Unique Opportunities for Performance and Reliability
• Aging and Reliability of Glass and Ceramics
• Robocasting : Layered Manufacturing by Slurry Extrusion
• Development of A Predictive Model for Ceramic Powder Compaction
• Relationship between Interfacial Interactions and Fracture Stress for Adhesive Joints in Mode II Loading
• Molecular Dynamics Simulations of Reactive Wetting in Ceramic-Metal Systems
• Synthesis and Processing of Composites by Reactive Metal Penetration
• Constrained Sintering of Multi-Material Systems
• Precursor's Structure Effects on Thin-Film Densification of TiO2
• Microelectrodes for Mesoscale Pitting Studies on Aluminum
• Qualification of Processes to Clean Kovar Parts
• Trilayer Kovar Screen Cleaning Process
• Kinetics of Atmospheric Copper Sulfidation
• Thin Film Dispenser Cathodes for Thermionic Micro-Devices
• Corrosion Testing and Field Monitoring of Strategic Petroleum Reserve Brinelines
• Corrosion Mechanisms of Au-Al Wirebonds in Microelectronic Devices
• Effects of Grain Orientation and Topology on Deformation
• Evaluating Tools for Simulating Polysilicon CVD for MEMS Applications
• Improving Surface Energetic Predictions for Large-Scale Simulations
• Molecular Dynamics Simulations of Reactive Wetting and Spreading
• Multiscale Modeling of Subgrain Development and Evolution
• Stagnation of Grain Growth in Polycrystalline Thin Films
• Linking Atomistic Computations with Phase Field Modeling
• Dynamics of Exchange at Gas-Zeolite Interfaces
• Computer Simulation of He Bubble Growth in Metals
• Segregation of Alloying Elements to Grain Boundaries
• PLS2001: Multivariate Analysis Code
• Aging and Degradation in Electrical Contacts
• Nonlinear Viscoelasticity of Curing Thermosets
• Removable Adhesives
• The Wear-out Approach for Predicting the Remaining Lifetime of Materials Applied to a Material with Induction-time Behavior
• Polymer Aging Studies
• Local Failure Criteria for the Cohesive Failure of Epoxy Encapsulants
• Characterizing Size Distribution Of Core-Shell Spherical Particles
• Spatial Gradients in Particle Reinforced Polymer Encapsulants
• Condition Monitoring of Elastomers by Nuclear Magnetic Resonance Relaxation Measurements
• Hydrolytic Degradation of Estane 5703:Chemistry and Morphology
• Low Temperature Direct Write of Electronic Components
• Solution-Deposited YBa2Cu3O7 Coated Conductor Tapes
• Structure for Quantifying Dynamic Friction and Adhesion in Surface Micromachines
• Ultra-long Working Distance Interference Microscope for MEMS Characterization
• Weld Visualization for Investigation of Solidification
• Investigation of Solidification Mode Change in Fe-Ni-Cr Alloys
• Percussive Arc Welding for a Neutron Generator Application
• Elevated Temperature Properties of Braze Alloys
• Interfacial Reactions for Ceramics Brazing
• Raman Study of Lead Zirconate Titanate Under Uniaxial Stress
• Phase ID: The Use of Electron Backscatter Diffraction for the Identification of Unknown Phases
• Porous Semiconductors: Formation, Properties, and Applications
• Spectrum Imaging and Information Extraction Robust and Automated Microanalysis
• Small Area Stress Analysis Using X-ray Microdiffraction Techniques
• Liquid Chromatography/Mass Spectrometry; A New Analytical Capability
• Bridging the Gap Between Computer Simulations and Experiment:Computation of NMR Spectroscopy for Amorphous Materials
• High-Resolution Transmission Electron Microscopy (HRTEM) Calibration of Linewidth Reference Materials for Semiconductor Metrology

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