|
|
Physical
and Mechanical Properties of ROP Sol-Gels
Polyorganosiloxane are noted for low
glass transition temperatures (Tg) and large coefficients of thermal expansion
(CTE). The non-shrinking sol-gels can be engineered to have TG’s between
-70 °C and 80 °C by varying the gel composition. The CTE can be engineered
(without filler) to between 100-400 ppm. Furthermore, the gels are thermally
stable to over 400 °C. Encapsulation of microelectronic test chips have
shown no shrinkage or excellent adhesion over several years.
Contact: Doug Loy
|
